Effects of Texturing Silicon Wafer Surfaces Using Metal-Assisted Chemical Etching (MACE) Technique

Aspect ratio; Electrochemical etching; Gallium alloys; Gallium arsenide; Gallium nitride; Gold deposits; Hydrofluoric acid; III-V semiconductors; Indium phosphide; Nanowires; Porosity; Porous silicon; Scanning electron microscopy; Semiconducting indium gallium arsenide; Semiconducting indium phosphi...

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Bibliographic Details
Main Authors: Razak N.H.A., Amin N., Kiong T.S., Sopian K., Akhtaruzzaman M.
Other Authors: 54397656800
Format: Conference Paper
Published: Institute of Electrical and Electronics Engineers Inc. 2023
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Summary:Aspect ratio; Electrochemical etching; Gallium alloys; Gallium arsenide; Gallium nitride; Gold deposits; Hydrofluoric acid; III-V semiconductors; Indium phosphide; Nanowires; Porosity; Porous silicon; Scanning electron microscopy; Semiconducting indium gallium arsenide; Semiconducting indium phosphide; Semiconductor alloys; Silicon solar cells; Silicon wafers; Wide band gap semiconductors; Chemical etching technique; High aspect ratio; Homo-junctions; Lattice damage; Metal-assisted chemical etching; Novel methods; Semiconductor nanostructures; Silicon nanowire and reflectance; Silicon wafer surface; Texturing silicons; Reflection