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Recent advances on thermally conductive adhesive in electronic packaging: A review

Adhesives; Electronics packaging; Fillers; Nanocomposites; Nanoparticles; Temperature control; Bonding strength; Conductive fillers; Electronic Packaging; Epoxy adhesives; Epoxy-based; Nano composite; Thermal; Thermally conductive adhesive; Thermally conductive adhesives; Thermal conductivity

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Bibliographic Details
Main Authors: Alim M.D., Abdullah M.Z., Aziz M.S.A., Kamarudin R., Gunnasegaran P.
Other Authors: 57527077400
Format: Review
Published: MDPI 2023
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spelling my.uniten.dspace-259602023-05-29T17:05:47Z Recent advances on thermally conductive adhesive in electronic packaging: A review Alim M.D. Abdullah M.Z. Aziz M.S.A. Kamarudin R. Gunnasegaran P. 57527077400 31567537400 36695908700 57215578097 35778031300 Adhesives; Electronics packaging; Fillers; Nanocomposites; Nanoparticles; Temperature control; Bonding strength; Conductive fillers; Electronic Packaging; Epoxy adhesives; Epoxy-based; Nano composite; Thermal; Thermally conductive adhesive; Thermally conductive adhesives; Thermal conductivity The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging. � 2021 by the authors. Licensee MDPI, Basel, Switzerland. Final 2023-05-29T09:05:47Z 2023-05-29T09:05:47Z 2021 Review 10.3390/polym13193337 2-s2.0-85117409843 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85117409843&doi=10.3390%2fpolym13193337&partnerID=40&md5=2bc60e9ff402ff75f3fa7ad20b37d5de https://irepository.uniten.edu.my/handle/123456789/25960 13 19 3337 All Open Access, Gold, Green MDPI Scopus
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description Adhesives; Electronics packaging; Fillers; Nanocomposites; Nanoparticles; Temperature control; Bonding strength; Conductive fillers; Electronic Packaging; Epoxy adhesives; Epoxy-based; Nano composite; Thermal; Thermally conductive adhesive; Thermally conductive adhesives; Thermal conductivity
author2 57527077400
author_facet 57527077400
Alim M.D.
Abdullah M.Z.
Aziz M.S.A.
Kamarudin R.
Gunnasegaran P.
format Review
author Alim M.D.
Abdullah M.Z.
Aziz M.S.A.
Kamarudin R.
Gunnasegaran P.
spellingShingle Alim M.D.
Abdullah M.Z.
Aziz M.S.A.
Kamarudin R.
Gunnasegaran P.
Recent advances on thermally conductive adhesive in electronic packaging: A review
author_sort Alim M.D.
title Recent advances on thermally conductive adhesive in electronic packaging: A review
title_short Recent advances on thermally conductive adhesive in electronic packaging: A review
title_full Recent advances on thermally conductive adhesive in electronic packaging: A review
title_fullStr Recent advances on thermally conductive adhesive in electronic packaging: A review
title_full_unstemmed Recent advances on thermally conductive adhesive in electronic packaging: A review
title_sort recent advances on thermally conductive adhesive in electronic packaging: a review
publisher MDPI
publishDate 2023
_version_ 1806428130550743040
score 13.223943

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