Review of Health Prognostics and Condition Monitoring of Electronic Components
Failure (mechanical); Green manufacturing; Network components; Reliability analysis; Electronic component; Failure mechanism; Fault diagnosis technique; Health prognostics; Intelligent tools; Reliable electronics; Remaining useful life predictions; Residual lifetime; Condition monitoring
Saved in:
Main Authors: | , , , , , , , |
---|---|
Other Authors: | |
Format: | Article |
Published: |
Institute of Electrical and Electronics Engineers Inc.
2023
|
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
id |
my.uniten.dspace-25734 |
---|---|
record_format |
dspace |
spelling |
my.uniten.dspace-257342023-05-29T16:13:34Z Review of Health Prognostics and Condition Monitoring of Electronic Components Bhargava C. Sharma P.K. Senthilkumar M. Padmanaban S. Ramachandaramurthy V.K. Leonowicz Z. Blaabjerg F. Mitolo M. 55641321100 57219058518 57198791439 18134802000 6602912020 6602973655 7004992352 22234653100 Failure (mechanical); Green manufacturing; Network components; Reliability analysis; Electronic component; Failure mechanism; Fault diagnosis technique; Health prognostics; Intelligent tools; Reliable electronics; Remaining useful life predictions; Residual lifetime; Condition monitoring To meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past development and recent advances in the areas about green manufacturing, maintenance, remaining useful life (RUL) prediction, and like. The current state of the art in reliability research for electronic components, mainly includes failure mechanisms, condition monitoring, and residual lifetime evaluation is explored. A critical analysis of reliability studies to identify their relative merits and usefulness of the outcome of these studies' vis-a-vis green manufacturing is presented. The wide array of statistical, empirical, and intelligent tools and techniques used in the literature are then identified and mapped. Finally, the findings are summarized, and the central research gap is highlighted. � 2013 IEEE. Final 2023-05-29T08:13:34Z 2023-05-29T08:13:34Z 2020 Article 10.1109/ACCESS.2020.2989410 2-s2.0-85084511007 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85084511007&doi=10.1109%2fACCESS.2020.2989410&partnerID=40&md5=0cb381937caf7ef9db02b0cfadba5190 https://irepository.uniten.edu.my/handle/123456789/25734 8 9075164 75163 75183 All Open Access, Gold, Green Institute of Electrical and Electronics Engineers Inc. Scopus |
institution |
Universiti Tenaga Nasional |
building |
UNITEN Library |
collection |
Institutional Repository |
continent |
Asia |
country |
Malaysia |
content_provider |
Universiti Tenaga Nasional |
content_source |
UNITEN Institutional Repository |
url_provider |
http://dspace.uniten.edu.my/ |
description |
Failure (mechanical); Green manufacturing; Network components; Reliability analysis; Electronic component; Failure mechanism; Fault diagnosis technique; Health prognostics; Intelligent tools; Reliable electronics; Remaining useful life predictions; Residual lifetime; Condition monitoring |
author2 |
55641321100 |
author_facet |
55641321100 Bhargava C. Sharma P.K. Senthilkumar M. Padmanaban S. Ramachandaramurthy V.K. Leonowicz Z. Blaabjerg F. Mitolo M. |
format |
Article |
author |
Bhargava C. Sharma P.K. Senthilkumar M. Padmanaban S. Ramachandaramurthy V.K. Leonowicz Z. Blaabjerg F. Mitolo M. |
spellingShingle |
Bhargava C. Sharma P.K. Senthilkumar M. Padmanaban S. Ramachandaramurthy V.K. Leonowicz Z. Blaabjerg F. Mitolo M. Review of Health Prognostics and Condition Monitoring of Electronic Components |
author_sort |
Bhargava C. |
title |
Review of Health Prognostics and Condition Monitoring of Electronic Components |
title_short |
Review of Health Prognostics and Condition Monitoring of Electronic Components |
title_full |
Review of Health Prognostics and Condition Monitoring of Electronic Components |
title_fullStr |
Review of Health Prognostics and Condition Monitoring of Electronic Components |
title_full_unstemmed |
Review of Health Prognostics and Condition Monitoring of Electronic Components |
title_sort |
review of health prognostics and condition monitoring of electronic components |
publisher |
Institute of Electrical and Electronics Engineers Inc. |
publishDate |
2023 |
_version_ |
1806428172652118016 |
score |
13.214268 |