Review of Health Prognostics and Condition Monitoring of Electronic Components

Failure (mechanical); Green manufacturing; Network components; Reliability analysis; Electronic component; Failure mechanism; Fault diagnosis technique; Health prognostics; Intelligent tools; Reliable electronics; Remaining useful life predictions; Residual lifetime; Condition monitoring

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Bibliographic Details
Main Authors: Bhargava C., Sharma P.K., Senthilkumar M., Padmanaban S., Ramachandaramurthy V.K., Leonowicz Z., Blaabjerg F., Mitolo M.
Other Authors: 55641321100
Format: Article
Published: Institute of Electrical and Electronics Engineers Inc. 2023
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spelling my.uniten.dspace-257342023-05-29T16:13:34Z Review of Health Prognostics and Condition Monitoring of Electronic Components Bhargava C. Sharma P.K. Senthilkumar M. Padmanaban S. Ramachandaramurthy V.K. Leonowicz Z. Blaabjerg F. Mitolo M. 55641321100 57219058518 57198791439 18134802000 6602912020 6602973655 7004992352 22234653100 Failure (mechanical); Green manufacturing; Network components; Reliability analysis; Electronic component; Failure mechanism; Fault diagnosis technique; Health prognostics; Intelligent tools; Reliable electronics; Remaining useful life predictions; Residual lifetime; Condition monitoring To meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past development and recent advances in the areas about green manufacturing, maintenance, remaining useful life (RUL) prediction, and like. The current state of the art in reliability research for electronic components, mainly includes failure mechanisms, condition monitoring, and residual lifetime evaluation is explored. A critical analysis of reliability studies to identify their relative merits and usefulness of the outcome of these studies' vis-a-vis green manufacturing is presented. The wide array of statistical, empirical, and intelligent tools and techniques used in the literature are then identified and mapped. Finally, the findings are summarized, and the central research gap is highlighted. � 2013 IEEE. Final 2023-05-29T08:13:34Z 2023-05-29T08:13:34Z 2020 Article 10.1109/ACCESS.2020.2989410 2-s2.0-85084511007 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85084511007&doi=10.1109%2fACCESS.2020.2989410&partnerID=40&md5=0cb381937caf7ef9db02b0cfadba5190 https://irepository.uniten.edu.my/handle/123456789/25734 8 9075164 75163 75183 All Open Access, Gold, Green Institute of Electrical and Electronics Engineers Inc. Scopus
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description Failure (mechanical); Green manufacturing; Network components; Reliability analysis; Electronic component; Failure mechanism; Fault diagnosis technique; Health prognostics; Intelligent tools; Reliable electronics; Remaining useful life predictions; Residual lifetime; Condition monitoring
author2 55641321100
author_facet 55641321100
Bhargava C.
Sharma P.K.
Senthilkumar M.
Padmanaban S.
Ramachandaramurthy V.K.
Leonowicz Z.
Blaabjerg F.
Mitolo M.
format Article
author Bhargava C.
Sharma P.K.
Senthilkumar M.
Padmanaban S.
Ramachandaramurthy V.K.
Leonowicz Z.
Blaabjerg F.
Mitolo M.
spellingShingle Bhargava C.
Sharma P.K.
Senthilkumar M.
Padmanaban S.
Ramachandaramurthy V.K.
Leonowicz Z.
Blaabjerg F.
Mitolo M.
Review of Health Prognostics and Condition Monitoring of Electronic Components
author_sort Bhargava C.
title Review of Health Prognostics and Condition Monitoring of Electronic Components
title_short Review of Health Prognostics and Condition Monitoring of Electronic Components
title_full Review of Health Prognostics and Condition Monitoring of Electronic Components
title_fullStr Review of Health Prognostics and Condition Monitoring of Electronic Components
title_full_unstemmed Review of Health Prognostics and Condition Monitoring of Electronic Components
title_sort review of health prognostics and condition monitoring of electronic components
publisher Institute of Electrical and Electronics Engineers Inc.
publishDate 2023
_version_ 1806428172652118016
score 13.214268