Symmetrical unit-cell numerical approach for flip-chip underfill flow simulation

• Main Authors: Ng F.C., Zawawi M.H., Tung L.H., Abas M.A., Abdullah M.Z.
• Other Authors: 57192101900
• Format: Article
• Published: Penerbit Akademia Baru 2023

Underfill process is a critical manufacturing process to safeguard and enhance the package reliability of flip-chip devices. In most underfill researches, the underfill flow was primarily investigated through numerical simulation. Nonetheless, the numerical simulation required a tremendously long ti...