Interaction effect of rca dilution, temperature and megasonic on particle removal efficiency, gate oxide quality, defect density and yield
Tweaking RCA (Radio Corporation of America) cleaning process has been the choice of many manufacturers in order to meet the stringent requirement of ITRS (International Technology Roadmap for Semiconductor) as the involvement cost and cycle time is low. It is necessary to understand the interaction...
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| Format: | Thesis |
| Language: | English |
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Universiti Malaysia Sarawak, UNIMAS
2009
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| Online Access: | http://ir.unimas.my/id/eprint/3152/1/Jane%20Chai%20Hai%20Sing%20ft.pdf http://ir.unimas.my/id/eprint/3152/ |
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| Summary: | Tweaking RCA (Radio Corporation of America) cleaning process has been the choice of many manufacturers in order to meet the stringent requirement of ITRS (International Technology Roadmap for Semiconductor) as the involvement cost and cycle time is low. It is necessary to understand the interaction effect of RCA variables in term of particle size and gate oxide quality. In addition, the current cleaning process facing pattern damage issue for smaller geometry integrated circuit. In this thesis, the possibility of using megasonic in QDR (Quick Dump Rinse) is studied. The main objective is to establish optimize cleaning process which able to outperform the standard cleaning with minimum cost. |
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