A study on thermal management in electronic packaging components
Thermal Management (TM) is the most important protection of the Integrated Circuit (IC) and electronic component. TM is one of the keys that has been purposes to the electronic packaging to cool and maintain the integrated circuit and electronic component.
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| Main Author: | |
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| Format: | Final Year Project Report |
| Language: | English English |
| Published: |
Universiti Malaysia Sarawak , (UNIMAS)
2002
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| Online Access: | http://ir.unimas.my/id/eprint/2773/1/A%20study%20on%20thermal%20management%20in%20electronic%20packaging%20components.pdf http://ir.unimas.my/id/eprint/2773/7/AWANG%20ALIAS%20%20ft.pdf http://ir.unimas.my/id/eprint/2773/ |
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