Cover Image

Effect of small addition of Al to SnZn solder alloys

Malaysian Technical Universities Conference on Engineering and Technology organized by Universiti Malaysia Pahang in collaboration with Universiti Tun Hussein Onn Malaysia, Universiti Teknikal Malaysia Melaka & Universiti Malaysia Perlis on June 20th - 22nd, 2009, at MS Garden Hotel, Kuantan, P...

Full description

Saved in:
Bibliographic Details
Main Authors: Nor Azwin, Ahad, Aw, Yah Yun
Format: Working Paper
Language:English
Published: Universiti Malaysia Pahang 2010
Subjects:
Lead-free solder alloy
SnZn
Al
Microstrucuture
Thermal properties
Malaysian Technical Universities Conference on Engineering and Technology (MUCEET)
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/8704
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.unimap-8704
record_format dspace
spelling my.unimap-87042010-08-16T09:05:09Z Effect of small addition of Al to SnZn solder alloys Nor Azwin, Ahad Aw, Yah Yun Lead-free solder alloy SnZn Al Microstrucuture Thermal properties Malaysian Technical Universities Conference on Engineering and Technology (MUCEET) Malaysian Technical Universities Conference on Engineering and Technology organized by Universiti Malaysia Pahang in collaboration with Universiti Tun Hussein Onn Malaysia, Universiti Teknikal Malaysia Melaka & Universiti Malaysia Perlis on June 20th - 22nd, 2009, at MS Garden Hotel, Kuantan, Pahang, Malaysia. The effects of Al on melting, microstructure and hardness properties of Sn9Zn lead free solders were investigated. SnZnAl solder in this study were produced via melting and casting method. Thermal properties (Tm) of the solder alloys were determined by Differential Scanning Calorimetry (DSC), mechanical properties were investigated by using Vickers Hardness and microstructure were observed by Scanning Electron Microscopy (SEM) and also element analysis were carried out by Energy Dispersive X ray (EDX). 2010-08-16T09:05:09Z 2010-08-16T09:05:09Z 2009-05-20 Working Paper http://hdl.handle.net/123456789/8704 en Proceedings of the Malaysian Technical Universities Conference on Engineering and Technology (MUCEET) 2009 Universiti Malaysia Pahang
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Lead-free solder alloy
SnZn
Al
Microstrucuture
Thermal properties
Malaysian Technical Universities Conference on Engineering and Technology (MUCEET)
spellingShingle Lead-free solder alloy
SnZn
Al
Microstrucuture
Thermal properties
Malaysian Technical Universities Conference on Engineering and Technology (MUCEET)
Nor Azwin, Ahad
Aw, Yah Yun
Effect of small addition of Al to SnZn solder alloys
description Malaysian Technical Universities Conference on Engineering and Technology organized by Universiti Malaysia Pahang in collaboration with Universiti Tun Hussein Onn Malaysia, Universiti Teknikal Malaysia Melaka & Universiti Malaysia Perlis on June 20th - 22nd, 2009, at MS Garden Hotel, Kuantan, Pahang, Malaysia.
format Working Paper
author Nor Azwin, Ahad
Aw, Yah Yun
author_facet Nor Azwin, Ahad
Aw, Yah Yun
author_sort Nor Azwin, Ahad
title Effect of small addition of Al to SnZn solder alloys
title_short Effect of small addition of Al to SnZn solder alloys
title_full Effect of small addition of Al to SnZn solder alloys
title_fullStr Effect of small addition of Al to SnZn solder alloys
title_full_unstemmed Effect of small addition of Al to SnZn solder alloys
title_sort effect of small addition of al to snzn solder alloys
publisher Universiti Malaysia Pahang
publishDate 2010
url http://dspace.unimap.edu.my/xmlui/handle/123456789/8704
_version_ 1643789203585105920
score 13.222552

Similar Items