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Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route

Master of Science in Materials Engineering

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Bibliographic Details
Main Author: Zawawi, Mahim
Other Authors: Norainiza, Saud, Dr.
Format: Thesis
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2018
Subjects:
Solder and soldering
Powder metallurgy
Solders
Composite solder
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/78028
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spelling my.unimap-780282023-03-07T01:26:55Z Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route Zawawi, Mahim Norainiza, Saud, Dr. Solder and soldering Powder metallurgy Solders Composite solder Master of Science in Materials Engineering Nowadays, composite solder has gain researcher’s attention due to its promising improvement in physical and mechanical properties for lead free solder. This study was carried out to investigate the effect of SiC particle on microstructure evolution, physical and mechanical properties of SAC and SnCu based solder alloys. Both SAC and SnCu composite solders were synthesized by powder metallurgy method (PM), which consistsof several processes such as mechanical blending, compaction and sintering. Five different weight percentages of SiC particles; 0.00, 0.25, 0.50, 0.75 and 1.00 were mechanically blended with SAC and SnCu lead-free solder. There were two phases involved. The first phase was investigation on the bulk composite solder properties and the second phase was investigation on the as-soldered composite solder connection. The wettability result showed the smallest contact angle for SnCu-SiC which is 18.60 degrees with 0.75 wt.% of SiC. While the smallest contact angle for SAC-SiC which is 20.00 degrees with 1.00 wt.% SiC. The optimum density value for SnCu-SiC and SACSiC were 7.162 g/cm3 and 7.274 g/cm3 respectively when 0.75 wt.% of SiC. The hardness values for SnCu-SiC samples was 13.0 HV starting at 0.75 wt.% to 1.00 wt.% of SiC addition while SAC-SiC reach the maximum value 18.6 HV at 1.00 wt.% of SiC addition. The shear strength for SnCu-SiC reach 14.95 MPa as an optimum value with addition 0.50 wt.% of SiC. After that, the value decreased until the addition 1.00 wt.% of SiC. The optimum value of SAC-SiC shear strength, 17.79 MPa was reached with the addition 0.50 wt.% of SiC. After that the value was decreased when the SiC addition has exceeded 0.75 wt.%. The electrical resistivity (ρ) of bulk SnCu-SiC and SAC-SiC composite lead-free solders was measured with a four-point probe. The result showed there only slightly affected by the addition of SiC for SnCu-SiC and SAC-SiC composite lead-free solders. The value of electrical resistivity for SnCu-SiC and SACSiC composite solder are decreasing when 0.75 wt. % and 1.00 wt. % of SiC particles were added which is their value is 1.18 μΩ.cm, 1.12 μΩ.cm, 0.88 μΩ.cm and 0.81 μΩ.cm respectively. As overall, the result detailed in this work indicate that the addition of SiC particles into SnCu and SAC based lead-free solder able to enhance their physical and mechanical properties. 2018 2023-03-07T01:26:55Z 2023-03-07T01:26:55Z Thesis http://dspace.unimap.edu.my:80/xmlui/handle/123456789/78028 en Universiti Malaysia Perlis (UniMAP) Universiti Malaysia Perlis (UniMAP) School of Materials Engineering
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Solder and soldering
Powder metallurgy
Solders
Composite solder
spellingShingle Solder and soldering
Powder metallurgy
Solders
Composite solder
Zawawi, Mahim
Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
description Master of Science in Materials Engineering
author2 Norainiza, Saud, Dr.
author_facet Norainiza, Saud, Dr.
Zawawi, Mahim
format Thesis
author Zawawi, Mahim
author_sort Zawawi, Mahim
title Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
title_short Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
title_full Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
title_fullStr Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
title_full_unstemmed Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
title_sort development od sic reinforced sncu and sac based lead-free solder composite via powder metallurgy route
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2018
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/78028
_version_ 1772813091169370112
score 13.214268

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