Description: Study the effect of isothermal aging on Sn-Ag-Cu (SAC) lead-free solder added with silicon carbide (SiC)

Master of Science in Materials Engineering

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Bibliographic Details
Main Author:	Nisrin, Adli
Other Authors:	Nurul Razliana, Abdul Razak
Format:	Thesis
Language:	English
Published:	Universiti Malaysia Perlis (UniMAP) 2017
Subjects:	Solder and soldering Atmospheric temperature
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77544
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Description
Summary:	Master of Science in Materials Engineering