Description: The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement

Master of Science in Materials Engineering

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Bibliographic Details
Main Author:	Mohd Izrul Izwan, Ramli
Other Authors:	Norainiza, Saud, Dr.
Format:	Thesis
Language:	English
Published:	Universiti Malaysia Perlis (UniMAP) 2016
Subjects:	Solder and soldering Tin alloys SnPb solders
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77175
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Description
Summary:	Master of Science in Materials Engineering