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Synthesis and characterization of lead free SnCu & SnCu/SiC composite solder

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Bibliographic Details
Main Author: Nur Syahirah, Mohamad Zaini
Other Authors: Dr Norainiza, Saud
Format: Other
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2022
Subjects:
Metallurgy
Solder
Composite solder
Lead free solders
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77134
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spelling my.unimap-771342022-11-23T02:03:51Z Synthesis and characterization of lead free SnCu & SnCu/SiC composite solder Nur Syahirah, Mohamad Zaini Dr Norainiza, Saud School of Materials Engineering Metallurgy Solder Composite solder Lead free solders Access is limited to UniMAP community. The hazardous contain in lead solders have stimulate the current researchers to develop a lead free solders with a same or superior properties. A new approach has been done by introduce a lead free composite solder with an outstanding properties than the monolithic lead free solders. In this study, the new lead free composite solder paste is developed by adding different weight percentage ( 0, 0.25, 0.50, 0.75 and 1.0 wt%) of Silicon Carbide, SiC into SnCu solder paste. The composite solder paste was prepared by mixing SnCu solder powder with flux to produce a solder in a paste form. Then, the solder paste was mixed with different weight percentage of SiC particles .The performance of composite solder paste were then analysed based on its melting point, printability, electrical resistivity, intermetallic compound (IMC) formation, wettability and the microhardness. The melting point and the electrical resistivity of SnCu composite solder paste was comparable with monolthic solder paste. Thus, the changes in conventional soldering process was not required. The printing performance of SnCu composite solder paste on Cu substrate showing better performance as the amount of SiC particles was increased. The IMC layer was found to be thinner as the amount of SiC particles was increased. The wettability of SnCu composite solder paste showing better contact angle than the monolithic SnCu solder paste with optimum contact angle of 7.579 º. The highest microhardness (10.88 HV) was achieved as 0.75 wt% of SiC particles was added. As overall, the result obtained indicate that, the addition of SiC particles could enhance the properties of solder paste. 2022-08 2022-11-23T02:02:51Z 2022-11-23T02:02:51Z 2017-06 Other http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77134 en Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Metallurgy
Solder
Composite solder
Lead free solders
spellingShingle Metallurgy
Solder
Composite solder
Lead free solders
Nur Syahirah, Mohamad Zaini
Synthesis and characterization of lead free SnCu & SnCu/SiC composite solder
description Access is limited to UniMAP community.
author2 Dr Norainiza, Saud
author_facet Dr Norainiza, Saud
Nur Syahirah, Mohamad Zaini
format Other
author Nur Syahirah, Mohamad Zaini
author_sort Nur Syahirah, Mohamad Zaini
title Synthesis and characterization of lead free SnCu & SnCu/SiC composite solder
title_short Synthesis and characterization of lead free SnCu & SnCu/SiC composite solder
title_full Synthesis and characterization of lead free SnCu & SnCu/SiC composite solder
title_fullStr Synthesis and characterization of lead free SnCu & SnCu/SiC composite solder
title_full_unstemmed Synthesis and characterization of lead free SnCu & SnCu/SiC composite solder
title_sort synthesis and characterization of lead free sncu & sncu/sic composite solder
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2022
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77134
_version_ 1753972986617004032
score 13.214268

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