Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging

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Main Authors: A., Suhaimi, G., Omar, M T Asmah
Other Authors: uhaimi.azizan83@gmail.com
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2022
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Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76286
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spelling my.unimap-762862022-10-06T02:32:48Z Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging A., Suhaimi G., Omar M T Asmah uhaimi.azizan83@gmail.com Asmaja Ventures, Kajang Fakulti Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka (UTeM) Automotive packaging Delamination Pre-plated leadframe Reliability Surface texturing Link to publisher's homepage at http://ijneam.unimap.edu.my Poor adhesion between mold compound and leadframe in integrated circuit packaging for automotive devices can cause serious reliability issue and degrade the package quality. This study aims to evaluate and understand the correlation between surface texturing procedure (roughening) on pre-plated leadframe (PPF) and delamination phenomenon in integrated circuit packaging. The pre-plated leadframe with textured surface was prepared by the leadframe supplier. Four major evaluations were conducted which based on morphology analysis, contact angle measurement, mold shear strength test and reliability test. For morphology analysis, textured PPF possessed higher surface roughness (284nm) compared with standard leadframe (174nm). The highest contact angle value was observed for textured PPF at room temperature (71°). Conversely, the lowest contact angle value was observed for textured PPF at 175°C (55°) which was simulated according to inline manufacturing condition. High shear strength test was obtained for textured PPF compared with standard leadframe. Furthermore, reliability test proved that no delamination was detected for PPF sample. However, this phenomenon was observed for standard leadframe. All the observations agreed that the interfacial adhesion between mold compound and leadframe was significantly improved by surface texturing procedure on the leadframe. The improvement of adhesion helps to eliminate delamination and improve package reliability. 2022-10-06T02:32:48Z 2022-10-06T02:32:48Z 2022-07 Article International Journal of Nanoelectronics and Materials, vol.15(3), 2022, pages 197-206 1985-5761 (Printed) 1985-5761 (Printed) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76286 http://ijneam.unimap.edu.my en Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Automotive packaging
Delamination
Pre-plated leadframe
Reliability
Surface texturing
spellingShingle Automotive packaging
Delamination
Pre-plated leadframe
Reliability
Surface texturing
A., Suhaimi
G., Omar
M T Asmah
Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging
description Link to publisher's homepage at http://ijneam.unimap.edu.my
author2 uhaimi.azizan83@gmail.com
author_facet uhaimi.azizan83@gmail.com
A., Suhaimi
G., Omar
M T Asmah
format Article
author A., Suhaimi
G., Omar
M T Asmah
author_sort A., Suhaimi
title Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging
title_short Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging
title_full Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging
title_fullStr Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging
title_full_unstemmed Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging
title_sort correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2022
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76286
_version_ 1751537911929503744
score 13.222552