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Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity

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Main Authors: Mohd Azli, Salim, Ameeruz Kamal, Ab Wahid, Nor Azmmi, Masripan, Chonlatee, Photong, Adzni, Md. Saad, Mohd Zaid, Akop, Muhd Ridzuan, Mansor
Other Authors: azli@utem.edu.my
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2022
Subjects:
GNP/Ag Hybrid
Die-attach materials
Steady-state thermal
Thermal resistance
Total heat flux
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76072
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spelling my.unimap-760722022-08-24T02:22:35Z Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity Mohd Azli, Salim Ameeruz Kamal, Ab Wahid Mohd Azli, Salim Nor Azmmi, Masripan Chonlatee, Photong Adzni, Md. Saad Mohd Zaid, Akop Muhd Ridzuan, Mansor azli@utem.edu.my Jabatan Kejuruteraan Mekanikal, Politeknik Sultan Azlan Shah Fakulti Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka (UTeM) Advanced Manufacturing Centre, Universiti Teknikal Malaysia Melaka (UTeM) Graduate School, Mahasarakham University GNP/Ag Hybrid Die-attach materials Steady-state thermal Thermal resistance Total heat flux Link to publisher's homepage at http://ijneam.unimap.edu.my The thermal conductivities of a multilayer model of GNP/Ag hybrid die-attach material are explored using steady-state thermal modeling. The heat flux in multilayer GNP/Ag hybrid structures is shown to be highly layer number dependent. It rises when thermal conductivity increases while density and specific heat value remain constant. For FEA analysis, six different thermal conductivity of GNP/Ag hybrid die-attach materials models were developed to compare with baseline findings from another researcher. By evaluating the total heat flux, FEA modeling was utilized to identify how the increase of thermal conductivity had affected the die-attach materials model. Fourier’s law of heat conduction was implemented to investigate thermal characteristics during heating with commercial software code, namely ANSYS. Temperature dependency and thermal material properties, and other thermal parameters boundary conditions were taken into consideration throughout the thermal conductivity procedure. The total heat flux distribution changes of dies with die-attach and substrate assemblies were obtained and thermal characteristics were analyzed during heating within 1 second by using temperature load, 90.3 ° C on the dies (diode) surface. Moreover, heat flow and material resistance were also manually calculated in the model by comparing the relationship discovered in the die-attach materials. GNP/Ag hybrid with the highest thermal conductivity, 300 W/m.K, offered the highest heat flux value in terms of simulation, 7.081 x 106 W/m2, and calculated, 24.695 x 106 W/m2. As a result, material resistance and heat flux were inversely proportional, and as material resistance reduced, so did heat flux or heat conduction on the material. Thermal conductivity values discovered on die-attach materials can also be utilized to demonstrate the similarities between thermal and material resistance. 2022-08-24T02:22:35Z 2022-08-24T02:22:35Z 2022-03 Article International Journal of Nanoelectronics and Materials, vol.15 (Special Issue), 2022, pages 381-391 1985-5761 (Printed) 2232-1535 (online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76072 http://ijneam.unimap.edu.my en Special Issue ISSTE 2022; Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic GNP/Ag Hybrid
Die-attach materials
Steady-state thermal
Thermal resistance
Total heat flux
spellingShingle GNP/Ag Hybrid
Die-attach materials
Steady-state thermal
Thermal resistance
Total heat flux
Mohd Azli, Salim
Ameeruz Kamal, Ab Wahid
Mohd Azli, Salim
Nor Azmmi, Masripan
Chonlatee, Photong
Adzni, Md. Saad
Mohd Zaid, Akop
Muhd Ridzuan, Mansor
Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity
description Link to publisher's homepage at http://ijneam.unimap.edu.my
author2 azli@utem.edu.my
author_facet azli@utem.edu.my
Mohd Azli, Salim
Ameeruz Kamal, Ab Wahid
Mohd Azli, Salim
Nor Azmmi, Masripan
Chonlatee, Photong
Adzni, Md. Saad
Mohd Zaid, Akop
Muhd Ridzuan, Mansor
format Article
author Mohd Azli, Salim
Ameeruz Kamal, Ab Wahid
Mohd Azli, Salim
Nor Azmmi, Masripan
Chonlatee, Photong
Adzni, Md. Saad
Mohd Zaid, Akop
Muhd Ridzuan, Mansor
author_sort Mohd Azli, Salim
title Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity
title_short Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity
title_full Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity
title_fullStr Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity
title_full_unstemmed Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity
title_sort numerical analysis of gnp/ag die-attach adhesives with different thermal conductivity
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2022
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76072
_version_ 1751537870855733248
score 13.214268

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