Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig

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Main Authors: M. Z., Akop, F., Jikol, Y. M., Arifin, M. A., Salim, S. G., Herawan
Other Authors: zaid@utem.edu.my
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2022
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Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75799
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spelling my.unimap-757992022-08-07T03:31:07Z Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig M. Z., Akop F., Jikol M. Z., Akop Y. M., Arifin M. A., Salim S. G., Herawan zaid@utem.edu.my Faculty of Mechanical Engineering, Universiti Teknikal Malaysia Melaka (UTeM) Industrial Engineering Department, Faculty of Engineering, Bina Nusantara University Aluminum alloy Convection Deposits Room temperature Transient thermal Link to publisher's homepage at http://ijneam.unimap.edu.my The purpose of this study is to investigate the transient thermal behavior of the convection process of a circular-shaped aluminum alloy plate used in the Hot Surface Deposition Test (HSDT) rig. The temperature distribution and its characteristics over time are investigated by applying certain thermal load and time dependence. As the real deposition test using HSDT involves a process of detaching the aluminum alloy circular plate from the heater block, the transient thermal analysis will provide a base for estimating the time required for the hot plate to cool down to room temperature (25°C-27°C) and safe to be handled. The process of modeling the geometry, meshing, applying the boundary conditions, and evaluating results are conducted experimentally using ANSYS Release 16.2 software. It is indicated in the analysis results that the aluminum alloy circular plate with higher internal temperature undergoes a longer convection process to cool down to room temperature. These results are used to estimate the cooling down time of the hot plate in the real deposition test. 2022 2022-08-07T03:31:07Z 2022-08-07T03:31:07Z 2022-03 Article International Journal of Nanoelectronics and Materials, vol.15 (Special Issue), 2022, pages 147-157 1985-5761 (Printed) 1997-4434 (Online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75799 http://ijneam.unimap.edu.my en Special Issue ISSTE 2022; Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Aluminum alloy
Convection
Deposits
Room temperature
Transient thermal
spellingShingle Aluminum alloy
Convection
Deposits
Room temperature
Transient thermal
M. Z., Akop
F., Jikol
M. Z., Akop
Y. M., Arifin
M. A., Salim
S. G., Herawan
Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig
description Link to publisher's homepage at http://ijneam.unimap.edu.my
author2 zaid@utem.edu.my
author_facet zaid@utem.edu.my
M. Z., Akop
F., Jikol
M. Z., Akop
Y. M., Arifin
M. A., Salim
S. G., Herawan
format Article
author M. Z., Akop
F., Jikol
M. Z., Akop
Y. M., Arifin
M. A., Salim
S. G., Herawan
author_sort M. Z., Akop
title Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig
title_short Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig
title_full Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig
title_fullStr Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig
title_full_unstemmed Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig
title_sort transient thermal analysis on convection process of circular plate used in hot surface deposition test rig
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2022
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75799
_version_ 1743108376602083328
score 13.222552