Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
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2022
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my.unimap-747542022-03-23T01:25:40Z Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing Mohd Arif Anuar, Mohd Salleh Sandu, Andrei Victor Vizureanu, Petrica Nur Syahirah, Mohamad Zaimi Mohd Arif Anuar, Mohd Salleh Sandu, Andrei Victor Mohd Mustafa Al Bakri, Abdullah Norainiza, Saud Shayfull Zamree, Abd Rahim Vizureanu, Petrica Rita, Mohd Said Mohd Izrul, Izwan Ramli arifanuar@unimap.edu.my sav@tuiasi.ro peviz@tuiasi.ro Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP) Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP) Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iasi Faculty of Mechanical Engineering Technology, Universiti Malaysia Perlis (UniMAP) Composite solder Intermetallics Microstructure Ageing Activation energy Lead-free solder geopolymer Geopolymer ceramic Link to publisher's homepage at https://www.mdpi.com/ This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder. 2022 2022-03-23T01:24:15Z 2022-03-23T01:24:15Z 2021-02 Article Materials, vol. 14(4), 2021, 19 pages 1996-1944 http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74754 https://doi.org/10.3390/ma14040776 en MDPI AG |
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Composite solder Intermetallics Microstructure Ageing Activation energy Lead-free solder geopolymer Geopolymer ceramic |
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Composite solder Intermetallics Microstructure Ageing Activation energy Lead-free solder geopolymer Geopolymer ceramic Mohd Arif Anuar, Mohd Salleh Sandu, Andrei Victor Vizureanu, Petrica Nur Syahirah, Mohamad Zaimi Mohd Arif Anuar, Mohd Salleh Sandu, Andrei Victor Mohd Mustafa Al Bakri, Abdullah Norainiza, Saud Shayfull Zamree, Abd Rahim Vizureanu, Petrica Rita, Mohd Said Mohd Izrul, Izwan Ramli Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing |
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Link to publisher's homepage at https://www.mdpi.com/ |
| author2 |
arifanuar@unimap.edu.my |
| author_facet |
arifanuar@unimap.edu.my Mohd Arif Anuar, Mohd Salleh Sandu, Andrei Victor Vizureanu, Petrica Nur Syahirah, Mohamad Zaimi Mohd Arif Anuar, Mohd Salleh Sandu, Andrei Victor Mohd Mustafa Al Bakri, Abdullah Norainiza, Saud Shayfull Zamree, Abd Rahim Vizureanu, Petrica Rita, Mohd Said Mohd Izrul, Izwan Ramli |
| format |
Article |
| author |
Mohd Arif Anuar, Mohd Salleh Sandu, Andrei Victor Vizureanu, Petrica Nur Syahirah, Mohamad Zaimi Mohd Arif Anuar, Mohd Salleh Sandu, Andrei Victor Mohd Mustafa Al Bakri, Abdullah Norainiza, Saud Shayfull Zamree, Abd Rahim Vizureanu, Petrica Rita, Mohd Said Mohd Izrul, Izwan Ramli |
| author_sort |
Mohd Arif Anuar, Mohd Salleh |
| title |
Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing |
| title_short |
Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing |
| title_full |
Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing |
| title_fullStr |
Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing |
| title_full_unstemmed |
Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing |
| title_sort |
performance of sn-3.0ag-0.5cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing |
| publisher |
MDPI AG |
| publishDate |
2022 |
| url |
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74754 |
| _version_ |
1729704801975926784 |
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13.209306 |