A review of geopolymer ceramic as a potential reinforcement material in solder alloys

Link to publisher's homepage at https://iopscience.iop.org/

Saved in:
Bibliographic Details
Main Authors: Nur Nadiah‘Izzati, Zulkiflii, Mohd Mustafa Al Bakri, Abdullah, Mohd Arif Anuar, Mohd Salleh
Other Authors: nadiahizzati.zulkifli@gmail.com
Format: Article
Language:English
Published: IOP Publishing Ltd 2022
Subjects:
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74686
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.unimap-74686
record_format dspace
spelling my.unimap-746862022-03-16T01:05:06Z A review of geopolymer ceramic as a potential reinforcement material in solder alloys Nur Nadiah‘Izzati, Zulkiflii Nur Nadiah‘Izzati, Zulkiflii Mohd Mustafa Al Bakri, Abdullah Mohd Arif Anuar, Mohd Salleh nadiahizzati.zulkifli@gmail.com School of Materials Engineering, Universiti Malaysia Perlis (UniMAP) Geopolymer ceramic Geopolymers Solder Link to publisher's homepage at https://iopscience.iop.org/ Nowadays, lead-free solder has been currently used in electronic packaging technology as part of soldering material. Since SnPb was detected to produce toxicity and might harm the consumers, the usage of Pb solder has been banned by WEE and RoHS. Therefore, various studies have been developed as alternatives to replace the usage of SnPb. Since lead-free solder might not perform as well as their traditional SnPb, researchers suggested to add some elemental reinforcement particles in matrix alloy. Previously, addition of ceramic reinforcement has been widely known in enhancing the properties of solder-substrate. This paper reviews about the presence studies of ceramic as solder reinforcement, the characteristics of geopolymer ceramic as potential solder reinforcement, and their properties in providing a superior solder joint. In this review, the characterization is divided into two stages; 1) characterization of geopolymers in terms of microstructural and crystallographic; 2) characterization of solder properties in terms of intermetallic layer growth (IMC), wettability, and its mechanical properties 2022 2022-03-16T01:05:06Z 2022-03-16T01:05:06Z 2019-12 Article IOP Conference Services: Material Sciences Engineering, vol.701, 2019, 8 pages 1757-899x (online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74686 https://doi.org/10.1088/1757-899x/701/1/012032 en IOP Publishing Ltd
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Geopolymer ceramic
Geopolymers
Solder
spellingShingle Geopolymer ceramic
Geopolymers
Solder
Nur Nadiah‘Izzati, Zulkiflii
Nur Nadiah‘Izzati, Zulkiflii
Mohd Mustafa Al Bakri, Abdullah
Mohd Arif Anuar, Mohd Salleh
A review of geopolymer ceramic as a potential reinforcement material in solder alloys
description Link to publisher's homepage at https://iopscience.iop.org/
author2 nadiahizzati.zulkifli@gmail.com
author_facet nadiahizzati.zulkifli@gmail.com
Nur Nadiah‘Izzati, Zulkiflii
Nur Nadiah‘Izzati, Zulkiflii
Mohd Mustafa Al Bakri, Abdullah
Mohd Arif Anuar, Mohd Salleh
format Article
author Nur Nadiah‘Izzati, Zulkiflii
Nur Nadiah‘Izzati, Zulkiflii
Mohd Mustafa Al Bakri, Abdullah
Mohd Arif Anuar, Mohd Salleh
author_sort Nur Nadiah‘Izzati, Zulkiflii
title A review of geopolymer ceramic as a potential reinforcement material in solder alloys
title_short A review of geopolymer ceramic as a potential reinforcement material in solder alloys
title_full A review of geopolymer ceramic as a potential reinforcement material in solder alloys
title_fullStr A review of geopolymer ceramic as a potential reinforcement material in solder alloys
title_full_unstemmed A review of geopolymer ceramic as a potential reinforcement material in solder alloys
title_sort review of geopolymer ceramic as a potential reinforcement material in solder alloys
publisher IOP Publishing Ltd
publishDate 2022
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74686
_version_ 1729704792354193408
score 13.214268