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Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review

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Main Authors: Mohd Arif Anuar, Mohd Salleh, Sandu, I G, Mohd Mustafa Al Bakri, Abdullah, Sandu, I
Other Authors: arifanuar@unimap.edu.my
Format: Article
Language:English
Published: IOP Publishing Ltd 2022
Subjects:
Nikel (Ni)
Solder
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74584
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spelling my.unimap-745842022-03-07T06:42:46Z Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review Mohd Arif Anuar, Mohd Salleh Sandu, I G Mohd Mustafa Al Bakri, Abdullah Sandu, I arifanuar@unimap.edu.my Nikel (Ni) Solder Link to publisher's homepage at https://iopscience.iop.org/ In this digital-age era, solder plays important role in electronic packaging industries. As interconnects material, solder provide an electrical and mechanical support to the electronics devices. Solder usually consist of two or more addition of microalloying. By microalloying addition, the solidification structure can be modified. This paper reviews the addition of Ni as microalloying in Sn-Cu lead free solder. Small additions of Ni resulted with an improvement of solder in microstructure and in intermetallic compounds. The stabilization of hexagonal structure of Cu6Sn5 in lead-free solder alloys occurred due to present of Ni 2022 2022-03-07T06:42:46Z 2022-03-07T06:42:46Z 2017-06 Article IOP Conference Services: Material Sciences Engineering, vol.209, 2017, 7 pages http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74584 https://doi.org/10.1088/1757-899x/209/1/012084 en International Conference on Innovative Research (ICIR Euroinvent 2017); IOP Publishing Ltd
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Nikel (Ni)
Solder
spellingShingle Nikel (Ni)
Solder
Mohd Arif Anuar, Mohd Salleh
Sandu, I G
Mohd Mustafa Al Bakri, Abdullah
Sandu, I
Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
description Link to publisher's homepage at https://iopscience.iop.org/
author2 arifanuar@unimap.edu.my
author_facet arifanuar@unimap.edu.my
Mohd Arif Anuar, Mohd Salleh
Sandu, I G
Mohd Mustafa Al Bakri, Abdullah
Sandu, I
format Article
author Mohd Arif Anuar, Mohd Salleh
Sandu, I G
Mohd Mustafa Al Bakri, Abdullah
Sandu, I
author_sort Mohd Arif Anuar, Mohd Salleh
title Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
title_short Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
title_full Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
title_fullStr Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
title_full_unstemmed Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
title_sort nickel (ni) microalloying additions in sn-cu lead-free solder. short review
publisher IOP Publishing Ltd
publishDate 2022
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74584
_version_ 1729704777968779264
score 13.18916

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