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Effect of different process parameters on the heat transfer of liquid coolant in electronic system

Master of Science in Materials Engineering

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Bibliographic Details
Main Author: Wan Mohd Arif, Wan Ibrahim
Other Authors: Yeoh, Cheow Keat, Dr.
Format: Thesis
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2017
Subjects:
Cooling systems
Heat > Transmission
Heat sinks (Electronics)
Heat transfer
Liquid coolant
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/72601
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spelling my.unimap-726012023-03-06T00:52:46Z Effect of different process parameters on the heat transfer of liquid coolant in electronic system Wan Mohd Arif, Wan Ibrahim Yeoh, Cheow Keat, Dr. Cooling systems Heat -- Transmission Heat sinks (Electronics) Heat transfer Liquid coolant Master of Science in Materials Engineering An effective heat transfer system is important for new technologies today to enhance the performance of heat transfer, especially, since the miniaturization of electronic system that resulted in dramatic increase in the amount of heat generated. In the case, where air cooling could not meet requirements, liquid cooling does offer significant cooling advantages over conventional air cooling because of its better thermal transfer property. But unsuitable selection of liquid coolants may result to low performance or problems to the cooling systems. This study investigates the effect of different process parameters on the heat transfer of the liquid cooling. Experimental investigations have been carried out for determining the cooling performance of distilled water, vegetable oil and alumina sols in cooling system of central processing units (CPU) at different parameters of input power and mass flow rate. Optimising the pH values is very crucial because it will determine the stability of alumina sols, an optimal pH value of pH 4 is obtained for the alumina sols. There is no significant effect to the viscosity of the alumina sols because of low concentrations of alumina particles are dispersed in base fluids. Input power is direct influence to the final temperatures of CPU block and fluids. The heat transfer coefficient of the fluids is improved and a clear decrease of the junction temperature between the heated component and the water cooling block due to the higher mass flow rate. Alumina sols show better heat removal capability and higher heat transfer coefficient than distilled water and vegetable oil due to the presence of alumina particles in the fluids. Experimental results emphasize the higher molarity of alumina sols contributes higher heat transfer coefficient. The heat removal capability of 0.1 M, 0.5 M and 1.0 M alumina sols have been found as much as 15.4 %, 32.3 % and 40.8 % higher than distilled water. This study recommend that a stable 1.0M alumina sol may be use as liquid coolant for CPU cooling system as well as in component test handlers in semiconductor industry. 2017 2021-10-22T02:14:54Z 2021-10-22T02:14:54Z Thesis http://dspace.unimap.edu.my:80/xmlui/handle/123456789/72601 en Universiti Malaysia Perlis (UniMAP) Universiti Malaysia Perlis (UniMAP) School of Materials Engineering
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Cooling systems
Heat -- Transmission
Heat sinks (Electronics)
Heat transfer
Liquid coolant
spellingShingle Cooling systems
Heat -- Transmission
Heat sinks (Electronics)
Heat transfer
Liquid coolant
Wan Mohd Arif, Wan Ibrahim
Effect of different process parameters on the heat transfer of liquid coolant in electronic system
description Master of Science in Materials Engineering
author2 Yeoh, Cheow Keat, Dr.
author_facet Yeoh, Cheow Keat, Dr.
Wan Mohd Arif, Wan Ibrahim
format Thesis
author Wan Mohd Arif, Wan Ibrahim
author_sort Wan Mohd Arif, Wan Ibrahim
title Effect of different process parameters on the heat transfer of liquid coolant in electronic system
title_short Effect of different process parameters on the heat transfer of liquid coolant in electronic system
title_full Effect of different process parameters on the heat transfer of liquid coolant in electronic system
title_fullStr Effect of different process parameters on the heat transfer of liquid coolant in electronic system
title_full_unstemmed Effect of different process parameters on the heat transfer of liquid coolant in electronic system
title_sort effect of different process parameters on the heat transfer of liquid coolant in electronic system
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2017
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/72601
_version_ 1772813061454823424
score 13.222552

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