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The evolutions of microstructure in pressureless Sintered Silver die attach material

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Main Authors: S.R., Esa, G., Omar, S.H. Sheikh, Md Fadzullah, K.S Siow, B., Abdul Rahim
Other Authors: ghazali@utem.edu.my
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2021
Subjects:
Grain size
Microstructure
Neck growth
Porosity
Sintered Ag
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/71491
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id my.unimap-71491
record_format dspace
spelling my.unimap-714912021-07-19T02:03:26Z The evolutions of microstructure in pressureless Sintered Silver die attach material S.R., Esa G., Omar S.H. Sheikh, Md Fadzullah K.S Siow B., Abdul Rahim ghazali@utem.edu.my Grain size Microstructure Neck growth Porosity Sintered Ag Link to publisher's homepage at http://ijneam.unimap.edu.my Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure evolutions of Ag particles under pressureless sintering in a polymeric adhesive binder at 200 °C, 250 °C, 275 °C, and 300 °C for a duration of 2 hours. The grains, particles, and neck growth observed via two-dimensional Focused Ion Beam (FIB) cuts on the samples at different sintering temperatures were associated with the atomic motions and reduction of surface energy that is the driving force for sintering. In this study, the pressureless sintering process in a polymeric adhesive binder successfully transformed the scattered Ag particles into a compact and dense Ag joining at 300 °C. The electrical conductivity value obtained at 300 °C was 5.2E+05 S/cm, which was the highest among the evaluation samples. 2021-07-19T02:03:26Z 2021-07-19T02:03:26Z 2021-04 Article International Journal of Nanoelectronics and Materials, vol.14(2), 2021, pages 179-194 1985-5761 (Printed) 1997-4434 (Online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/71491 en Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Grain size
Microstructure
Neck growth
Porosity
Sintered Ag
spellingShingle Grain size
Microstructure
Neck growth
Porosity
Sintered Ag
S.R., Esa
G., Omar
S.H. Sheikh, Md Fadzullah
K.S Siow
B., Abdul Rahim
The evolutions of microstructure in pressureless Sintered Silver die attach material
description Link to publisher's homepage at http://ijneam.unimap.edu.my
author2 ghazali@utem.edu.my
author_facet ghazali@utem.edu.my
S.R., Esa
G., Omar
S.H. Sheikh, Md Fadzullah
K.S Siow
B., Abdul Rahim
format Article
author S.R., Esa
G., Omar
S.H. Sheikh, Md Fadzullah
K.S Siow
B., Abdul Rahim
author_sort S.R., Esa
title The evolutions of microstructure in pressureless Sintered Silver die attach material
title_short The evolutions of microstructure in pressureless Sintered Silver die attach material
title_full The evolutions of microstructure in pressureless Sintered Silver die attach material
title_fullStr The evolutions of microstructure in pressureless Sintered Silver die attach material
title_full_unstemmed The evolutions of microstructure in pressureless Sintered Silver die attach material
title_sort evolutions of microstructure in pressureless sintered silver die attach material
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2021
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/71491
_version_ 1724609802727849984
score 13.222552

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