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Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process

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Main Authors: Chu Yee, Khor, Muhammad Ikman, Ishak, M.U., Rosli, Mohd Riduan, Jamalludin, M.S., Zakaria, A.F.M., Yamin, M.S., Abdul Aziz, M.Z., Abdullah
Other Authors: cykhor@unimap.edu.my
Format: Article
Language:English
Published: EDP Sciences 2020
Subjects:
Epoxy moulding compound (EMC)
Moulded underfill process (MUF)
Finite volume (FV)
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68727
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spelling my.unimap-687272020-11-16T04:23:20Z Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process Chu Yee, Khor Muhammad Ikman, Ishak M.U., Rosli Mohd Riduan, Jamalludin M.S., Zakaria A.F.M., Yamin M.S., Abdul Aziz M.Z., Abdullah cykhor@unimap.edu.my Epoxy moulding compound (EMC) Moulded underfill process (MUF) Finite volume (FV) Link to publisher's homepage at https://www.matec-conferences.org/ This paper presents the investigation of the effects of epoxy moulding compound’ (EMC) viscosity on the FSI aspects during moulded underfill process (MUF). Finite volume (FV) code and finite element (FE) code were connected online through the Mesh-based Parallel Code Coupling Interface (MpCCI) method for fluid and structural analysis. The EMC flow behaviour was modelled by Castro-Macosko model, which was written in C language and incorporated into the FV analysis. Real-time predictions on the flow front, chip deformation and stress concentration were solved by FV- and FE-solver. Increase in EMC viscosity raises the deformation and stress imposed on IC and solder bump, which may induce unintended features on the IC structure. The current simulation is expected to provide the better understandings and clear visualization of FSI in the moulded underfill process. 2020-11-16T04:23:20Z 2020-11-16T04:23:20Z 2017-02 Article MATEC Web Conferences, vol.97, 2017, 6 pages 2261-236X (online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68727 https://doi.org/10.1051/matecconf/20179701059 en Engineering Technology International Conference 2016 (ETIC 2016); EDP Sciences
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Epoxy moulding compound (EMC)
Moulded underfill process (MUF)
Finite volume (FV)
spellingShingle Epoxy moulding compound (EMC)
Moulded underfill process (MUF)
Finite volume (FV)
Chu Yee, Khor
Muhammad Ikman, Ishak
M.U., Rosli
Mohd Riduan, Jamalludin
M.S., Zakaria
A.F.M., Yamin
M.S., Abdul Aziz
M.Z., Abdullah
Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
description Link to publisher's homepage at https://www.matec-conferences.org/
author2 cykhor@unimap.edu.my
author_facet cykhor@unimap.edu.my
Chu Yee, Khor
Muhammad Ikman, Ishak
M.U., Rosli
Mohd Riduan, Jamalludin
M.S., Zakaria
A.F.M., Yamin
M.S., Abdul Aziz
M.Z., Abdullah
format Article
author Chu Yee, Khor
Muhammad Ikman, Ishak
M.U., Rosli
Mohd Riduan, Jamalludin
M.S., Zakaria
A.F.M., Yamin
M.S., Abdul Aziz
M.Z., Abdullah
author_sort Chu Yee, Khor
title Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_short Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_full Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_fullStr Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_full_unstemmed Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_sort influence of material properties on the fluid-structure interaction aspects during molded underfill process
publisher EDP Sciences
publishDate 2020
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68727
_version_ 1698698502185418752
score 13.18916

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