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The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM

Link to publisher's homepage at http://link.aip.org/link/?APCPCS/909/118/1

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Main Authors: Mohd Khairuddin, Md Arshad, Mohd Nazrin, Md Isa, Sohiful Anuar, Zainol Murad
Format: Article
Language:English
Published: American Institute of Physics 2009
Subjects:
Electroless nickel immersion gold (ENIG)
Scanning electron microscope (SEM)
Under bump metallurgy (UBM)
Surface morphology
Surface roughness
Zincation
Electroless deposition
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/6615
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spelling my.unimap-66152009-12-15T03:02:46Z The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM Mohd Khairuddin, Md Arshad Mohd Nazrin, Md Isa Sohiful Anuar, Zainol Murad Electroless nickel immersion gold (ENIG) Scanning electron microscope (SEM) Under bump metallurgy (UBM) Surface morphology Surface roughness Zincation Electroless deposition Link to publisher's homepage at http://link.aip.org/link/?APCPCS/909/118/1 This paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond pad, followed by cleaning, activation, first zincation, zinc removal, second zincation, electroless nickel and lastly immersion gold process. The result shows that the surface morphology of initial bond pad starts to change with deposition of zinc layer and further changes with deposition of nickel and gold layer. 2009-07-29T08:40:10Z 2009-07-29T08:40:10Z 2007-05-09 Article AIP Conf. Proc., p.118-123 http://link.aip.org/link/?APCPCS/909/118/1 http://hdl.handle.net/123456789/6615 en Proceedings of the 2nd International Conference on Solid State Science and Technology 2006 (ICSSST 2006) American Institute of Physics
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Electroless nickel immersion gold (ENIG)
Scanning electron microscope (SEM)
Under bump metallurgy (UBM)
Surface morphology
Surface roughness
Zincation
Electroless deposition
spellingShingle Electroless nickel immersion gold (ENIG)
Scanning electron microscope (SEM)
Under bump metallurgy (UBM)
Surface morphology
Surface roughness
Zincation
Electroless deposition
Mohd Khairuddin, Md Arshad
Mohd Nazrin, Md Isa
Sohiful Anuar, Zainol Murad
The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
description Link to publisher's homepage at http://link.aip.org/link/?APCPCS/909/118/1
format Article
author Mohd Khairuddin, Md Arshad
Mohd Nazrin, Md Isa
Sohiful Anuar, Zainol Murad
author_facet Mohd Khairuddin, Md Arshad
Mohd Nazrin, Md Isa
Sohiful Anuar, Zainol Murad
author_sort Mohd Khairuddin, Md Arshad
title The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
title_short The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
title_full The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
title_fullStr The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
title_full_unstemmed The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
title_sort surface morphology characterization of electroless nickel immersion gold under bump metallurgy (ubm) using sem
publisher American Institute of Physics
publishDate 2009
url http://dspace.unimap.edu.my/xmlui/handle/123456789/6615
_version_ 1643788571154317312
score 13.214268

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