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Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder

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Main Authors: Mohd Izrul, Izwan Ramli, Mohd Arif Anuar, Mohd Salleh, Mohd Nazree, Derman, R.M. Said, Norhayanti, Mohd Nasir, Norainiza, Saud
Format: Article
Language:English
Published: Trans Tech Publications Ltd. 2019
Subjects:
Alloys
Intermetallic
Powder metallurgy
Silicon Nitride
Soldering alloy
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63577
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spelling my.unimap-635772019-12-03T08:19:53Z Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder Mohd Izrul, Izwan Ramli Mohd Arif Anuar, Mohd Salleh Mohd Nazree, Derman R.M. Said Norhayanti, Mohd Nasir Norainiza, Saud Alloys Intermetallic Powder metallurgy Silicon Nitride Soldering alloy Link to publisher's homepage at https://www.scientific.net The wettability and mechanical properties of solder the joint of Sn-Cu-Ni-xSi3N4 had been investigated. In this study, five different silicon nitride (Si3N4) percentage addition were chosen (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %). Contact angle measurement demonstrated that with Si3N4 addition, the wetting perfomances had been improved with the decrease of wettability contact angle. It is believed that the Si3N4 particles suppresses the interfacial IMC growth and thus improves the shear strength. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of Si3N4), the higher the shear strength of the joint. Fracture surface of sheared samples shows a combination of both brittle and ductile fracture. 2019-12-03T08:19:53Z 2019-12-03T08:19:53Z 2016-07 Article Key Engineering Materials, vol.700, 2016, 152-160. 1662-9795 http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63577 https://doi.org/10.4028/www.scientific.net/KEM.700.152 en Trans Tech Publications Ltd.
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Alloys
Intermetallic
Powder metallurgy
Silicon Nitride
Soldering alloy
spellingShingle Alloys
Intermetallic
Powder metallurgy
Silicon Nitride
Soldering alloy
Mohd Izrul, Izwan Ramli
Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman
R.M. Said
Norhayanti, Mohd Nasir
Norainiza, Saud
Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder
description Link to publisher's homepage at https://www.scientific.net
format Article
author Mohd Izrul, Izwan Ramli
Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman
R.M. Said
Norhayanti, Mohd Nasir
Norainiza, Saud
author_facet Mohd Izrul, Izwan Ramli
Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman
R.M. Said
Norhayanti, Mohd Nasir
Norainiza, Saud
author_sort Mohd Izrul, Izwan Ramli
title Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder
title_short Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder
title_full Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder
title_fullStr Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder
title_full_unstemmed Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder
title_sort wettability and shear strength of sn-cu-ni-xsi3n4 composite solder
publisher Trans Tech Publications Ltd.
publishDate 2019
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63577
_version_ 1654961444988387328
score 13.222552

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