Electrical and microstructural properties of silver thin films

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Main Authors: Shiva, L. U, Ayachit, N. H., Udachan, L. A
Other Authors: shivaudachan8@gmail.com
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2019
Subjects:
TCR
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/59855
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spelling my.unimap-598552019-05-10T06:49:18Z Electrical and microstructural properties of silver thin films Shiva, L. U Ayachit, N. H. Udachan, L. A shivaudachan8@gmail.com Thin silver films Electrical resistivity The electron mean free path TCR Microstructural properties Link to publisher's homepage at http://ijneam.unimap.edu.my The growth, structure and electrical properties of evaporated thin silver (Ag) films have been extensively investigated over the years because it has the highest electrical conductivity among all metals. The Ag thin films have been studied by thermal evaporation on glass, mica and Teflon. The thickness of Ag films in this investigation is in the range of 10-150 nm. The electrical properties include measurement of resistivity, the temperature coefficient of resistance (TCR), and activation energy (Ea) as a function of film thickness (t) have been studied. The experimental results are analyzed in the light of Fuchs-Sondheimer (FS) and Mayadas-Shatzkes (MS) theories. The resistivity of infinitely thick Ag film and TCR are found to be 3.53 × 10-8 Ω-m and 3.73 × 10-3/°C, respectively. The mean free path of conduction electron calculated from the resistivity and TCR data are 42.8 nm and 26.28 nm, respectively. A study on the initial stages of growth of Ag films and its microstructural properties has been conducted using a Scanning Electron Microscope (SEM) for films grown on different substrates and thickness. 2019-05-10T06:49:18Z 2019-05-10T06:49:18Z 2019-04 Article International Journal of Nanoelectronics and Materials, vol.12(2), 2019, pages 221-236 1985-5761 (Printed) 1997-4434 (Online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/59855 http://ijneam.unimap.edu.my en Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Thin silver films
Electrical resistivity
The electron mean free path
TCR
Microstructural properties
spellingShingle Thin silver films
Electrical resistivity
The electron mean free path
TCR
Microstructural properties
Shiva, L. U
Ayachit, N. H.
Udachan, L. A
Electrical and microstructural properties of silver thin films
description Link to publisher's homepage at http://ijneam.unimap.edu.my
author2 shivaudachan8@gmail.com
author_facet shivaudachan8@gmail.com
Shiva, L. U
Ayachit, N. H.
Udachan, L. A
format Article
author Shiva, L. U
Ayachit, N. H.
Udachan, L. A
author_sort Shiva, L. U
title Electrical and microstructural properties of silver thin films
title_short Electrical and microstructural properties of silver thin films
title_full Electrical and microstructural properties of silver thin films
title_fullStr Electrical and microstructural properties of silver thin films
title_full_unstemmed Electrical and microstructural properties of silver thin films
title_sort electrical and microstructural properties of silver thin films
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2019
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/59855
_version_ 1643806197952806912
score 13.18916