Electrical and microstructural properties of silver thin films
Link to publisher's homepage at http://ijneam.unimap.edu.my
Saved in:
Main Authors: | , , |
---|---|
Other Authors: | |
Format: | Article |
Language: | English |
Published: |
Universiti Malaysia Perlis (UniMAP)
2019
|
Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/59855 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
id |
my.unimap-59855 |
---|---|
record_format |
dspace |
spelling |
my.unimap-598552019-05-10T06:49:18Z Electrical and microstructural properties of silver thin films Shiva, L. U Ayachit, N. H. Udachan, L. A shivaudachan8@gmail.com Thin silver films Electrical resistivity The electron mean free path TCR Microstructural properties Link to publisher's homepage at http://ijneam.unimap.edu.my The growth, structure and electrical properties of evaporated thin silver (Ag) films have been extensively investigated over the years because it has the highest electrical conductivity among all metals. The Ag thin films have been studied by thermal evaporation on glass, mica and Teflon. The thickness of Ag films in this investigation is in the range of 10-150 nm. The electrical properties include measurement of resistivity, the temperature coefficient of resistance (TCR), and activation energy (Ea) as a function of film thickness (t) have been studied. The experimental results are analyzed in the light of Fuchs-Sondheimer (FS) and Mayadas-Shatzkes (MS) theories. The resistivity of infinitely thick Ag film and TCR are found to be 3.53 × 10-8 Ω-m and 3.73 × 10-3/°C, respectively. The mean free path of conduction electron calculated from the resistivity and TCR data are 42.8 nm and 26.28 nm, respectively. A study on the initial stages of growth of Ag films and its microstructural properties has been conducted using a Scanning Electron Microscope (SEM) for films grown on different substrates and thickness. 2019-05-10T06:49:18Z 2019-05-10T06:49:18Z 2019-04 Article International Journal of Nanoelectronics and Materials, vol.12(2), 2019, pages 221-236 1985-5761 (Printed) 1997-4434 (Online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/59855 http://ijneam.unimap.edu.my en Universiti Malaysia Perlis (UniMAP) |
institution |
Universiti Malaysia Perlis |
building |
UniMAP Library |
collection |
Institutional Repository |
continent |
Asia |
country |
Malaysia |
content_provider |
Universiti Malaysia Perlis |
content_source |
UniMAP Library Digital Repository |
url_provider |
http://dspace.unimap.edu.my/ |
language |
English |
topic |
Thin silver films Electrical resistivity The electron mean free path TCR Microstructural properties |
spellingShingle |
Thin silver films Electrical resistivity The electron mean free path TCR Microstructural properties Shiva, L. U Ayachit, N. H. Udachan, L. A Electrical and microstructural properties of silver thin films |
description |
Link to publisher's homepage at http://ijneam.unimap.edu.my |
author2 |
shivaudachan8@gmail.com |
author_facet |
shivaudachan8@gmail.com Shiva, L. U Ayachit, N. H. Udachan, L. A |
format |
Article |
author |
Shiva, L. U Ayachit, N. H. Udachan, L. A |
author_sort |
Shiva, L. U |
title |
Electrical and microstructural properties of silver thin films |
title_short |
Electrical and microstructural properties of silver thin films |
title_full |
Electrical and microstructural properties of silver thin films |
title_fullStr |
Electrical and microstructural properties of silver thin films |
title_full_unstemmed |
Electrical and microstructural properties of silver thin films |
title_sort |
electrical and microstructural properties of silver thin films |
publisher |
Universiti Malaysia Perlis (UniMAP) |
publishDate |
2019 |
url |
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/59855 |
_version_ |
1643806197952806912 |
score |
13.214268 |