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Aging effect of Sn-Ag-Cu lead free solder

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Bibliographic Details
Main Author: Mohd Jeffry, Radzi
Other Authors: Nor Azwin Ahad
Format: Other
Language:English
Published: Universiti Malaysia Perlis 2009
Subjects:
Alloys
Solder and soldering
Solder pastes
Electronic packaging
Lead free solders
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/5506
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spelling my.unimap-55062009-04-15T08:18:53Z Aging effect of Sn-Ag-Cu lead free solder Mohd Jeffry, Radzi Nor Azwin Ahad Alloys Solder and soldering Solder pastes Electronic packaging Lead free solders Access is limited to UniMAP community. Many issue related to the performance of lead free solder alloys have arisen. So, it should be take concern on it and one of the method is by studying the microstructure of those solder alloys. This because their mechanical properties also depend on the microstructure and also the stability of the microstructure. A comprehensive understanding of the process microstructure property relationships is essential. Toward that goal, lead free solder alloy candidates such Sn-3.0Ag-0.5C was studied in their microstructure because a comprehensive understanding of the microstructure is still lacking. Ternary alloy such Sn-3.0Ag-0.5Cu is one of the most promising lead free solder alloy for reflow soldering. A microstructure analysis is performed by using digital microscopy. A detailed microstructure characterization with respect to phase compositions has been done by using SEM-EDX. From these study, the influence of alloying element such Cu will effect in microstructure and its mechanical properties. The network microstructure of Sn-3.0Ag-0.5Cu consist of CuSn5 and AgSn in the matrix of the ß-Sn. The melting temperature range of this solder only can be as reference for selection of solder for its application. 2009-04-15T08:18:53Z 2009-04-15T08:18:53Z 2008-03 Other http://hdl.handle.net/123456789/5506 en Universiti Malaysia Perlis School of Materials Engineering
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Alloys
Solder and soldering
Solder pastes
Electronic packaging
Lead free solders
spellingShingle Alloys
Solder and soldering
Solder pastes
Electronic packaging
Lead free solders
Mohd Jeffry, Radzi
Aging effect of Sn-Ag-Cu lead free solder
description Access is limited to UniMAP community.
author2 Nor Azwin Ahad
author_facet Nor Azwin Ahad
Mohd Jeffry, Radzi
format Other
author Mohd Jeffry, Radzi
author_sort Mohd Jeffry, Radzi
title Aging effect of Sn-Ag-Cu lead free solder
title_short Aging effect of Sn-Ag-Cu lead free solder
title_full Aging effect of Sn-Ag-Cu lead free solder
title_fullStr Aging effect of Sn-Ag-Cu lead free solder
title_full_unstemmed Aging effect of Sn-Ag-Cu lead free solder
title_sort aging effect of sn-ag-cu lead free solder
publisher Universiti Malaysia Perlis
publishDate 2009
url http://dspace.unimap.edu.my/xmlui/handle/123456789/5506
_version_ 1643788280957763584
score 13.209306

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