Graphite as an intermetallic compound (IMC) substitution for a robust solder joint

• Main Authors: Fatin Afeeqa, Mohd Sobri, Norhayanti, Mohd Nasir, Rita, Mohd Said, Mohd Izrul Izwan, Ramli, Muhammad Hafiz, Zan@Hazizi, Azmi, Kamardin, Mohd Arif Anuar, Mohd Salleh
• 其他作者: Fatin Afeeqa Binti Mohd Sobri
• 格式: Image
• 語言: English
• 出版: Universiti Malaysia Perlis (UniMAP) 2015
• 主題: Diploma Programe Coordination Unit; Intermetallic compound (IMC); Research > UniMAP; Technical innovations > UniMAP; International Engineering Invention & Innovation Exhibition (i-ENVEX 2015); Solder
• 在線閱讀: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/40501

The 6th International Engineering Invention & Innovation Exhibition 2015 (i-ENVEX 2015) was organized by ENVEX Young Researcher Club (EYReC), University Malaysia Perlis (UniMAP) and Ministry of Higher Education (MOHE), Malaysia on 17th - 19th April 2015, at UniMAP Main Campus, Pauh Putra, Perlis...