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Graphite as an intermetallic compound (IMC) substitution for a robust solder joint

The 6th International Engineering Invention & Innovation Exhibition 2015 (i-ENVEX 2015) was organized by ENVEX Young Researcher Club (EYReC), University Malaysia Perlis (UniMAP) and Ministry of Higher Education (MOHE), Malaysia on 17th - 19th April 2015, at UniMAP Main Campus, Pauh Putra, Perlis...

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Main Authors: Fatin Afeeqa, Mohd Sobri, Norhayanti, Mohd Nasir, Rita, Mohd Said, Mohd Izrul Izwan, Ramli, Muhammad Hafiz, Zan@Hazizi, Azmi, Kamardin, Mohd Arif Anuar, Mohd Salleh
Other Authors: Fatin Afeeqa Binti Mohd Sobri
Format: Image
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2015
Subjects:
Diploma Programe Coordination Unit
Intermetallic compound (IMC)
Research > UniMAP
Technical innovations > UniMAP
International Engineering Invention & Innovation Exhibition (i-ENVEX 2015)
Solder
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/40501
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spelling my.unimap-405012015-09-22T06:28:05Z Graphite as an intermetallic compound (IMC) substitution for a robust solder joint Fatin Afeeqa, Mohd Sobri Norhayanti, Mohd Nasir Rita, Mohd Said Mohd Izrul Izwan, Ramli Muhammad Hafiz, Zan@Hazizi Azmi, Kamardin Mohd Arif Anuar, Mohd Salleh Fatin Afeeqa Binti Mohd Sobri Diploma Programe Coordination Unit Intermetallic compound (IMC) Research -- UniMAP Technical innovations -- UniMAP International Engineering Invention & Innovation Exhibition (i-ENVEX 2015) Solder The 6th International Engineering Invention & Innovation Exhibition 2015 (i-ENVEX 2015) was organized by ENVEX Young Researcher Club (EYReC), University Malaysia Perlis (UniMAP) and Ministry of Higher Education (MOHE), Malaysia on 17th - 19th April 2015, at UniMAP Main Campus, Pauh Putra, Perlis. Conventionally, Sn-Pb types of solder were highly used in the electronic packaging industries as it excels in most of its properties. But, then it was realized that lead (Pb) were hazardous to the invironment and human health, so it was banned and restricted from usage by many countries of the world. With this, various researches were done in an effort to develop alternative solder. Several types of lead-free solder have been introduced with most common lead-free solders used nowadays are Sn-Ag-Cu and Sn-Cu. By introducing reinforcementto the solder can further be enhanced. Sn-Cu solder alloy were incorporated with graphite which acts as a reinforcement and the solder composites were produced by using powder metallurgy (PM) method which consists of mixing, compactingand sintering. This technique is economical as it produced low scrap with low energy consumption and needs no skilled worker to aperate the machines. 2015-09-22T06:28:05Z 2015-09-22T06:28:05Z 2015-04-17 Image http://dspace.unimap.edu.my:80/xmlui/handle/123456789/40501 en International Engineering Invention & Innovation Exhibition (i-ENVEX 2015); Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Diploma Programe Coordination Unit
Intermetallic compound (IMC)
Research -- UniMAP
Technical innovations -- UniMAP
International Engineering Invention & Innovation Exhibition (i-ENVEX 2015)
Solder
spellingShingle Diploma Programe Coordination Unit
Intermetallic compound (IMC)
Research -- UniMAP
Technical innovations -- UniMAP
International Engineering Invention & Innovation Exhibition (i-ENVEX 2015)
Solder
Fatin Afeeqa, Mohd Sobri
Norhayanti, Mohd Nasir
Rita, Mohd Said
Mohd Izrul Izwan, Ramli
Muhammad Hafiz, Zan@Hazizi
Azmi, Kamardin
Mohd Arif Anuar, Mohd Salleh
Graphite as an intermetallic compound (IMC) substitution for a robust solder joint
description The 6th International Engineering Invention & Innovation Exhibition 2015 (i-ENVEX 2015) was organized by ENVEX Young Researcher Club (EYReC), University Malaysia Perlis (UniMAP) and Ministry of Higher Education (MOHE), Malaysia on 17th - 19th April 2015, at UniMAP Main Campus, Pauh Putra, Perlis.
author2 Fatin Afeeqa Binti Mohd Sobri
author_facet Fatin Afeeqa Binti Mohd Sobri
Fatin Afeeqa, Mohd Sobri
Norhayanti, Mohd Nasir
Rita, Mohd Said
Mohd Izrul Izwan, Ramli
Muhammad Hafiz, Zan@Hazizi
Azmi, Kamardin
Mohd Arif Anuar, Mohd Salleh
format Image
author Fatin Afeeqa, Mohd Sobri
Norhayanti, Mohd Nasir
Rita, Mohd Said
Mohd Izrul Izwan, Ramli
Muhammad Hafiz, Zan@Hazizi
Azmi, Kamardin
Mohd Arif Anuar, Mohd Salleh
author_sort Fatin Afeeqa, Mohd Sobri
title Graphite as an intermetallic compound (IMC) substitution for a robust solder joint
title_short Graphite as an intermetallic compound (IMC) substitution for a robust solder joint
title_full Graphite as an intermetallic compound (IMC) substitution for a robust solder joint
title_fullStr Graphite as an intermetallic compound (IMC) substitution for a robust solder joint
title_full_unstemmed Graphite as an intermetallic compound (IMC) substitution for a robust solder joint
title_sort graphite as an intermetallic compound (imc) substitution for a robust solder joint
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2015
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/40501
_version_ 1643799378312298496
score 13.222552

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