Cylindrical shape slug heat conduction numerical analysis using copper material
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AENSI Publications
2014
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my.unimap-355252014-06-16T00:59:04Z Cylindrical shape slug heat conduction numerical analysis using copper material Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. Vairavan, Rajendaran zaliman@unimap.edu.my vc.sundress@gmail.com vc@unimap.edu.my Ansys Cylindrical copper diamond composite heat slug GaN LED Junction temperature Link to publisher's homepage at http://www.aensiweb.com/ High power light emitting diodes have the edge over the conventional lighting system in terms of efficiency, low energy consumption and long operational lifetime. Nevertheless, the heat dissipation issue of the high power LED bottlenecks the fulfilment of the potential possessed by the LED. The heat dissipation of LED is evaluated in terms of junction temperature. In this work, simulation was carried out to evaluate the heat dissipation of a single chip LED attached to a copper based cylindrical heat slug. The junction temperature and the stress of the LED chip were scrutinized under natural convection condition with applied input power of 0.1 W and 1 W. Ansys version 11 was utilized for the simulation. For input power of 1 W, the maximum junction temperature and Von Mises of 117.44°C and 229.21MPa was exhibited by the GaN based chip. 2014-06-16T00:59:04Z 2014-06-16T00:59:04Z 2013-10 Article Advances in Environmental Biology, vol. 7(SPEC. ISSUE 12), 2013, pages 3639-3643 1995-0756 http://www.aensiweb.com/old/aeb_October-special_2013.html http://dspace.unimap.edu.my:80/dspace/handle/123456789/35525 en AENSI Publications |
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Universiti Malaysia Perlis |
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Malaysia |
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Universiti Malaysia Perlis |
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http://dspace.unimap.edu.my/ |
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English |
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Ansys Cylindrical copper diamond composite heat slug GaN LED Junction temperature |
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Ansys Cylindrical copper diamond composite heat slug GaN LED Junction temperature Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. Vairavan, Rajendaran Cylindrical shape slug heat conduction numerical analysis using copper material |
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Link to publisher's homepage at http://www.aensiweb.com/ |
| author2 |
zaliman@unimap.edu.my |
| author_facet |
zaliman@unimap.edu.my Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. Vairavan, Rajendaran |
| format |
Article |
| author |
Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. Vairavan, Rajendaran |
| author_sort |
Zaliman, Sauli, Dr. |
| title |
Cylindrical shape slug heat conduction numerical analysis using copper material |
| title_short |
Cylindrical shape slug heat conduction numerical analysis using copper material |
| title_full |
Cylindrical shape slug heat conduction numerical analysis using copper material |
| title_fullStr |
Cylindrical shape slug heat conduction numerical analysis using copper material |
| title_full_unstemmed |
Cylindrical shape slug heat conduction numerical analysis using copper material |
| title_sort |
cylindrical shape slug heat conduction numerical analysis using copper material |
| publisher |
AENSI Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/35525 |
| _version_ |
1643797793451540480 |
| score |
13.251813 |