5mm × 5mm sized slug on high power LED stress and junction temperature analysis
Link to publisher's homepage at http://www.ttp.net/
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications (TTP)
2014
|
| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/35374 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| id |
my.unimap-35374 |
|---|---|
| record_format |
dspace |
| spelling |
my.unimap-353742014-06-11T08:28:40Z 5mm × 5mm sized slug on high power LED stress and junction temperature analysis Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Vairavan, Rajendaran Nazuhusna, Khalid zaliman@unimap.edu.my vc.sundress@gmail.com fairul@unimap.edu.my phaklen@unimap.edu.my nazuhusna@unimap.edu.my 5mm × 5mm heat slug Aluminum heat slug Ansys Single chip LED Thermal analysis Link to publisher's homepage at http://www.ttp.net/ Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and efficiency of the LED is dependent on the junction temperature. This study presents the thermal simulation of single chip LED package with 5mm ×5mm× 1mm aluminum heat slug. The junction temperature and stress of LED chip were evaluated using Ansys version 11. Input power of 0.1 W and 1 W were applied to the LED. The simulation results showed that at input power of 1W, the maximum junction temperature and stress of the LED chip is 112.91°C and 263.82Mpa respectively. 2014-06-11T08:28:40Z 2014-06-11T08:28:40Z 2013 Article Applied Mechanics and Materials, vol. 404, 2013, pages 460-464 978-303785845-5 1660-9336 http://www.scientific.net/AMM.404.460 http://dspace.unimap.edu.my:80/dspace/handle/123456789/35374 en Trans Tech Publications (TTP) |
| institution |
Universiti Malaysia Perlis |
| building |
UniMAP Library |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Malaysia Perlis |
| content_source |
UniMAP Library Digital Repository |
| url_provider |
http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
5mm × 5mm heat slug Aluminum heat slug Ansys Single chip LED Thermal analysis |
| spellingShingle |
5mm × 5mm heat slug Aluminum heat slug Ansys Single chip LED Thermal analysis Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Vairavan, Rajendaran Nazuhusna, Khalid 5mm × 5mm sized slug on high power LED stress and junction temperature analysis |
| description |
Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
zaliman@unimap.edu.my |
| author_facet |
zaliman@unimap.edu.my Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Vairavan, Rajendaran Nazuhusna, Khalid |
| format |
Article |
| author |
Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Vairavan, Rajendaran Nazuhusna, Khalid |
| author_sort |
Zaliman, Sauli, Dr. |
| title |
5mm × 5mm sized slug on high power LED stress and junction temperature analysis |
| title_short |
5mm × 5mm sized slug on high power LED stress and junction temperature analysis |
| title_full |
5mm × 5mm sized slug on high power LED stress and junction temperature analysis |
| title_fullStr |
5mm × 5mm sized slug on high power LED stress and junction temperature analysis |
| title_full_unstemmed |
5mm × 5mm sized slug on high power LED stress and junction temperature analysis |
| title_sort |
5mm × 5mm sized slug on high power led stress and junction temperature analysis |
| publisher |
Trans Tech Publications (TTP) |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/35374 |
| _version_ |
1643797777496408064 |
| score |
13.222552 |