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Relationship between controllable process parameters on bump height in ENIG

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Main Authors: Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Fairul Afzal, Ahmad Fuad, Ehkan, Phaklen, Dr., Muhamad Hafiz,  Ab Aziz
Other Authors: zaliman@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Bump height
DOE
ENIG
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/35335
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spelling my.unimap-353352014-06-10T09:08:40Z Relationship between controllable process parameters on bump height in ENIG Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Muhamad Hafiz,  Ab Aziz zaliman@unimap.edu.my vc.sundress@gmail.com fairul@unimap.edu.my phaklen@unimap.edu.my muhamadhafiz@unimap.edu.my Bump height DOE ENIG Link to publisher's homepage at http://www.ttp.net/ This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a certain quality and requirements of bump height needs to be achieved prior to reflow oven soldering process. A total of four controllable process variables, with 16 sets of experiments were studied using a systematically designed design of experiment (DOE). The result suggests that the electroless nickel bath time has the most significant effect on the formation on bump height and consequently provide larger area for conductivity. 2014-06-10T09:08:40Z 2014-06-10T09:08:40Z 2013 Article Applied Mechanics and Materials, vol. 404, 2013, pages 62-66 978-303785845-5 1660-9336 http://www.scientific.net/AMM.404.62 http://dspace.unimap.edu.my:80/dspace/handle/123456789/35335 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Bump height
DOE
ENIG
spellingShingle Bump height
DOE
ENIG
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Fairul Afzal, Ahmad Fuad
Ehkan, Phaklen, Dr.
Muhamad Hafiz,  Ab Aziz
Relationship between controllable process parameters on bump height in ENIG
description Link to publisher's homepage at http://www.ttp.net/
author2 zaliman@unimap.edu.my
author_facet zaliman@unimap.edu.my
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Fairul Afzal, Ahmad Fuad
Ehkan, Phaklen, Dr.
Muhamad Hafiz,  Ab Aziz
format Article
author Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Fairul Afzal, Ahmad Fuad
Ehkan, Phaklen, Dr.
Muhamad Hafiz,  Ab Aziz
author_sort Zaliman, Sauli, Dr.
title Relationship between controllable process parameters on bump height in ENIG
title_short Relationship between controllable process parameters on bump height in ENIG
title_full Relationship between controllable process parameters on bump height in ENIG
title_fullStr Relationship between controllable process parameters on bump height in ENIG
title_full_unstemmed Relationship between controllable process parameters on bump height in ENIG
title_sort relationship between controllable process parameters on bump height in enig
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/35335
_version_ 1643797771075977216
score 13.222552

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