The properties of epoxy resin coated silica fillers composites

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Main Authors: Teh, Pei Leng, Dr., Mariatti, Mustapha, Hazizan, Md Akil, Yeoh, Cheow Keat, Dr., Seetharamu, Kankanhally N., Amir Nur Rashid, Wagiman, Beh, Keh Shin
Other Authors: tpleng98@yahoo.com
Format: Article
Language:English
Published: Elsevier Ltd. 2014
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Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34482
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spelling my.unimap-344822014-05-16T08:18:31Z The properties of epoxy resin coated silica fillers composites Teh, Pei Leng, Dr. Mariatti, Mustapha Hazizan, Md Akil Yeoh, Cheow Keat, Dr. Seetharamu, Kankanhally N. Amir Nur Rashid, Wagiman Beh, Keh Shin tpleng98@yahoo.com mariatti@eng.usm.my hazizan@eng.usm.my yck5@yahoo.com knseetharamu@hotmail.com amir.nur.rashid.wagiman@intel.com keh.shin.beh@intel.com Ceramic filler Electronic packaging Epoxy Polymer Link to publisher's homepage at http://www.sciencedirect.com/ Epoxy resin coated silica fillers composites with high percentage of filler loading, such as 80 to 95 vol.% are able to be produced by a mechanical mixing technique. The advantages of high filler loading of theses materials are noted from the thermal and flexural modulus. Apparently, the materials exhibit low coefficient of thermal expansion (CTE) at as low as or below 10 ppm/°C and high flexural modulus of above 20 GPa. In general, these promising characteristics fulfill the requirement to be used as substrate materials in electronic packaging applications. 2014-05-16T08:18:31Z 2014-05-16T08:18:31Z 2007-05 Article Materials Letters, vol. 61(11-12), 2007, pages 2156-2158 0167-577X http://www.sciencedirect.com/science/article/pii/S0167577X06010524 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34482 http://dx.doi.org/10.1016/j.matlet.2006.08.036 en Elsevier Ltd.
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Ceramic filler
Electronic packaging
Epoxy
Polymer
spellingShingle Ceramic filler
Electronic packaging
Epoxy
Polymer
Teh, Pei Leng, Dr.
Mariatti, Mustapha
Hazizan, Md Akil
Yeoh, Cheow Keat, Dr.
Seetharamu, Kankanhally N.
Amir Nur Rashid, Wagiman
Beh, Keh Shin
The properties of epoxy resin coated silica fillers composites
description Link to publisher's homepage at http://www.sciencedirect.com/
author2 tpleng98@yahoo.com
author_facet tpleng98@yahoo.com
Teh, Pei Leng, Dr.
Mariatti, Mustapha
Hazizan, Md Akil
Yeoh, Cheow Keat, Dr.
Seetharamu, Kankanhally N.
Amir Nur Rashid, Wagiman
Beh, Keh Shin
format Article
author Teh, Pei Leng, Dr.
Mariatti, Mustapha
Hazizan, Md Akil
Yeoh, Cheow Keat, Dr.
Seetharamu, Kankanhally N.
Amir Nur Rashid, Wagiman
Beh, Keh Shin
author_sort Teh, Pei Leng, Dr.
title The properties of epoxy resin coated silica fillers composites
title_short The properties of epoxy resin coated silica fillers composites
title_full The properties of epoxy resin coated silica fillers composites
title_fullStr The properties of epoxy resin coated silica fillers composites
title_full_unstemmed The properties of epoxy resin coated silica fillers composites
title_sort properties of epoxy resin coated silica fillers composites
publisher Elsevier Ltd.
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/34482
_version_ 1643797499573436416
score 13.214268