The properties of epoxy resin coated silica fillers composites
Link to publisher's homepage at http://www.sciencedirect.com/
Saved in:
| Main Authors: | , , , , , , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
Elsevier Ltd.
2014
|
| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/34482 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| id |
my.unimap-34482 |
|---|---|
| record_format |
dspace |
| spelling |
my.unimap-344822014-05-16T08:18:31Z The properties of epoxy resin coated silica fillers composites Teh, Pei Leng, Dr. Mariatti, Mustapha Hazizan, Md Akil Yeoh, Cheow Keat, Dr. Seetharamu, Kankanhally N. Amir Nur Rashid, Wagiman Beh, Keh Shin tpleng98@yahoo.com mariatti@eng.usm.my hazizan@eng.usm.my yck5@yahoo.com knseetharamu@hotmail.com amir.nur.rashid.wagiman@intel.com keh.shin.beh@intel.com Ceramic filler Electronic packaging Epoxy Polymer Link to publisher's homepage at http://www.sciencedirect.com/ Epoxy resin coated silica fillers composites with high percentage of filler loading, such as 80 to 95 vol.% are able to be produced by a mechanical mixing technique. The advantages of high filler loading of theses materials are noted from the thermal and flexural modulus. Apparently, the materials exhibit low coefficient of thermal expansion (CTE) at as low as or below 10 ppm/°C and high flexural modulus of above 20 GPa. In general, these promising characteristics fulfill the requirement to be used as substrate materials in electronic packaging applications. 2014-05-16T08:18:31Z 2014-05-16T08:18:31Z 2007-05 Article Materials Letters, vol. 61(11-12), 2007, pages 2156-2158 0167-577X http://www.sciencedirect.com/science/article/pii/S0167577X06010524 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34482 http://dx.doi.org/10.1016/j.matlet.2006.08.036 en Elsevier Ltd. |
| institution |
Universiti Malaysia Perlis |
| building |
UniMAP Library |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Malaysia Perlis |
| content_source |
UniMAP Library Digital Repository |
| url_provider |
http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
Ceramic filler Electronic packaging Epoxy Polymer |
| spellingShingle |
Ceramic filler Electronic packaging Epoxy Polymer Teh, Pei Leng, Dr. Mariatti, Mustapha Hazizan, Md Akil Yeoh, Cheow Keat, Dr. Seetharamu, Kankanhally N. Amir Nur Rashid, Wagiman Beh, Keh Shin The properties of epoxy resin coated silica fillers composites |
| description |
Link to publisher's homepage at http://www.sciencedirect.com/ |
| author2 |
tpleng98@yahoo.com |
| author_facet |
tpleng98@yahoo.com Teh, Pei Leng, Dr. Mariatti, Mustapha Hazizan, Md Akil Yeoh, Cheow Keat, Dr. Seetharamu, Kankanhally N. Amir Nur Rashid, Wagiman Beh, Keh Shin |
| format |
Article |
| author |
Teh, Pei Leng, Dr. Mariatti, Mustapha Hazizan, Md Akil Yeoh, Cheow Keat, Dr. Seetharamu, Kankanhally N. Amir Nur Rashid, Wagiman Beh, Keh Shin |
| author_sort |
Teh, Pei Leng, Dr. |
| title |
The properties of epoxy resin coated silica fillers composites |
| title_short |
The properties of epoxy resin coated silica fillers composites |
| title_full |
The properties of epoxy resin coated silica fillers composites |
| title_fullStr |
The properties of epoxy resin coated silica fillers composites |
| title_full_unstemmed |
The properties of epoxy resin coated silica fillers composites |
| title_sort |
properties of epoxy resin coated silica fillers composites |
| publisher |
Elsevier Ltd. |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/34482 |
| _version_ |
1643797499573436416 |
| score |
13.222552 |