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Thermal properties of microsilica and nanosilica filled polypropylene composite with epoxy as dispersing aid

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Bibliographic Details
Main Authors: Leng, P. B., Hazizan, Md Akil, Ong, Hui Lin, Dr.
Other Authors: hazizan@eng.usm.my
Format: Article
Language:English
Published: SAGE Publications 2014
Subjects:
Epoxy resin
Microcomposites
Nanocomposites
Silica
Thermal properties
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34426
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spelling my.unimap-344262014-05-15T07:14:24Z Thermal properties of microsilica and nanosilica filled polypropylene composite with epoxy as dispersing aid Leng, P. B. Hazizan, Md Akil Ong, Hui Lin, Dr. hazizan@eng.usm.my hlong@unimap.edu.my Epoxy resin Microcomposites Nanocomposites Silica Thermal properties Link to publisher's homepage at http://jrp.sagepub.com/ Nanocomposite materials differ from the traditional composite materials in that they provide enhanced properties at comparatively low filler loading with respect to microsize filler. In this research work, silica filled polypropylene micro and nanocomposites were prepared and compared in terms of their thermal properties. Both composites were prepared by the melt blending method using a Thermo Haake internal mixer. Later, the epoxy resin was used as a dispersing aid to improve the adhesion between silica and polypropylene. For comparison purposes, 1% and 2% w/w of nanosilica filler is assumed to be comparable to 10% and 20% w/w of microsilica filler. Both composites at various compositions of fillers were subjected to thermal analysis including differential scanning calorimetry (DSC) and thermal gravimetric analysis (TGA). From DSC analysis, the melting point of micro and nanocomposites remain almost the same as neat polypropylene. By adding the nanosize filler into the composite system, an increase in the degree of crystallinity was observed. In general, the nanocomposites exhibited comparable or better properties over the microcomposites. The employment of epoxy resins as a dispersing aid has adversely affected the properties of the composites (i.e., nano and microcomposites). However, the results were encouraging at relatively low levels of filler loading. 2014-05-15T07:14:24Z 2014-05-15T07:14:24Z 2007 Article Journal of Reinforced Plastics and Composites, vol. 26(8), 2007, pages 761-770 0731-6844 http://jrp.sagepub.com/content/26/8/761.short http://dspace.unimap.edu.my:80/dspace/handle/123456789/34426 10.1177/0731684407076711 en SAGE Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Epoxy resin
Microcomposites
Nanocomposites
Silica
Thermal properties
spellingShingle Epoxy resin
Microcomposites
Nanocomposites
Silica
Thermal properties
Leng, P. B.
Hazizan, Md Akil
Ong, Hui Lin, Dr.
Thermal properties of microsilica and nanosilica filled polypropylene composite with epoxy as dispersing aid
description Link to publisher's homepage at http://jrp.sagepub.com/
author2 hazizan@eng.usm.my
author_facet hazizan@eng.usm.my
Leng, P. B.
Hazizan, Md Akil
Ong, Hui Lin, Dr.
format Article
author Leng, P. B.
Hazizan, Md Akil
Ong, Hui Lin, Dr.
author_sort Leng, P. B.
title Thermal properties of microsilica and nanosilica filled polypropylene composite with epoxy as dispersing aid
title_short Thermal properties of microsilica and nanosilica filled polypropylene composite with epoxy as dispersing aid
title_full Thermal properties of microsilica and nanosilica filled polypropylene composite with epoxy as dispersing aid
title_fullStr Thermal properties of microsilica and nanosilica filled polypropylene composite with epoxy as dispersing aid
title_full_unstemmed Thermal properties of microsilica and nanosilica filled polypropylene composite with epoxy as dispersing aid
title_sort thermal properties of microsilica and nanosilica filled polypropylene composite with epoxy as dispersing aid
publisher SAGE Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/34426
_version_ 1643797485099941888
score 13.214268

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