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Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software

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Main Authors: Mazlan, Mohamed, A. Rahim, Iqbal, M. A., Mohd Mustafa Al Bakri, Abdullah, Wan Yusra Hannanah, Wan Abdul Razak, Mohd Nor Hakim, Hassan
Other Authors: mazlan547@ppinang.uitm.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Microprocessors
Plastic Leaded Chip Carrier
Thermal Management
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34336
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spelling my.unimap-343362014-05-06T04:33:53Z Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software Mazlan, Mohamed A. Rahim Iqbal, M. A. Mohd Mustafa Al Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Mohd Nor Hakim, Hassan mazlan547@ppinang.uitm.edu.my mustafa_albakri@unimap.edu.my Microprocessors Plastic Leaded Chip Carrier Thermal Management Link to publisher's homepage at http://www.ttp.net/ Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a printed circuit board, is carried out using a commercial CFD code, FLUENT™. The simulation is performed for 12 PLCC under different inlet velocities and chip powers. The contours of average junction temperatures are obtained for each package under different conditions. It is observed that the junction temperature of the packages decreases with increase in inlet velocity and increases with chip power. Moreover, the increase in package density significantly contributed to rise in temperature of chips. Thus the present simulation demonstrates that the chip density (the number of packages mounted on a given area), chip power and the coolant inlet velocity are strongly interconnected; hence their appropriate choice would be crucial. 2014-05-06T04:33:53Z 2014-05-06T04:33:53Z 2013 Article Advanced Materials Research, vol. 795, 2013, pages 603-610 978-303785811-0 1022-6680 http://www.scientific.net/AMR.795.603 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34336 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Microprocessors
Plastic Leaded Chip Carrier
Thermal Management
spellingShingle Microprocessors
Plastic Leaded Chip Carrier
Thermal Management
Mazlan, Mohamed
A. Rahim
Iqbal, M. A.
Mohd Mustafa Al Bakri, Abdullah
Wan Yusra Hannanah, Wan Abdul Razak
Mohd Nor Hakim, Hassan
Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software
description Link to publisher's homepage at http://www.ttp.net/
author2 mazlan547@ppinang.uitm.edu.my
author_facet mazlan547@ppinang.uitm.edu.my
Mazlan, Mohamed
A. Rahim
Iqbal, M. A.
Mohd Mustafa Al Bakri, Abdullah
Wan Yusra Hannanah, Wan Abdul Razak
Mohd Nor Hakim, Hassan
format Article
author Mazlan, Mohamed
A. Rahim
Iqbal, M. A.
Mohd Mustafa Al Bakri, Abdullah
Wan Yusra Hannanah, Wan Abdul Razak
Mohd Nor Hakim, Hassan
author_sort Mazlan, Mohamed
title Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software
title_short Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software
title_full Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software
title_fullStr Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software
title_full_unstemmed Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software
title_sort numerical investigation of heat transfer of twelve plastic leaded chip carrier (plcc) by using computational fluid dynamic, fluent™ software
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/34336
_version_ 1643797450589208576
score 13.222552

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