The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™
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my.unimap-343322014-05-06T04:13:09Z The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™ Mazlan, Mohamed Anizah, Kalam, Dr. Nik Rosli, Abdullah, Dr. Loo, Huck Soo, Prof. Madya Ir. Dr. Mohd Mustafa Al Bakri, Abdullah M. S., Abdul Aziz Khor, C. Y. Mohammad Amizi, Ayob Mohd Sukhairi, Mat Rasat mazlan.m@umk.edu.my anizahkalam@salam.uitm.edu.my loo962@salam.uitm.edu.my mustafa_albakri@unimap.edu.my amizi@umk.edu.my sukhairi@umk.edu.my FLUENT™ Gap Plastic leaded chip carrier (PLCC) Thermal management Link to publisher's homepage at www.aensiweb.com/ This paper presents the effect of gap between Plastic Leaded Chip Carrier (PLCC) by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for twomicroprocessors arranged in line under different types of inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature and thermal resistance of each package. The junction temperature is been observed and it was found that the junction temperature of the microprocessors is not exceed 70°C. It also found that the gap between PLCC play important rolesto control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent. 2014-05-06T04:13:09Z 2014-05-06T04:13:09Z 2013-10 Article Advances in Environmental Biology, vol. 7(SPEC. ISSUE 12), October 2013, pages 3843-3849 1995-0756 http://www.aensiweb.com/aeb_October-special_2013.html http://dspace.unimap.edu.my:80/dspace/handle/123456789/34332 en AENSI Publisher All rights reserved |
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English |
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FLUENT™ Gap Plastic leaded chip carrier (PLCC) Thermal management |
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FLUENT™ Gap Plastic leaded chip carrier (PLCC) Thermal management Mazlan, Mohamed Anizah, Kalam, Dr. Nik Rosli, Abdullah, Dr. Loo, Huck Soo, Prof. Madya Ir. Dr. Mohd Mustafa Al Bakri, Abdullah M. S., Abdul Aziz Khor, C. Y. Mohammad Amizi, Ayob Mohd Sukhairi, Mat Rasat The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™ |
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Link to publisher's homepage at www.aensiweb.com/ |
| author2 |
mazlan.m@umk.edu.my |
| author_facet |
mazlan.m@umk.edu.my Mazlan, Mohamed Anizah, Kalam, Dr. Nik Rosli, Abdullah, Dr. Loo, Huck Soo, Prof. Madya Ir. Dr. Mohd Mustafa Al Bakri, Abdullah M. S., Abdul Aziz Khor, C. Y. Mohammad Amizi, Ayob Mohd Sukhairi, Mat Rasat |
| format |
Article |
| author |
Mazlan, Mohamed Anizah, Kalam, Dr. Nik Rosli, Abdullah, Dr. Loo, Huck Soo, Prof. Madya Ir. Dr. Mohd Mustafa Al Bakri, Abdullah M. S., Abdul Aziz Khor, C. Y. Mohammad Amizi, Ayob Mohd Sukhairi, Mat Rasat |
| author_sort |
Mazlan, Mohamed |
| title |
The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™ |
| title_short |
The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™ |
| title_full |
The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™ |
| title_fullStr |
The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™ |
| title_full_unstemmed |
The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™ |
| title_sort |
effect of gap between plastic leaded chip carrier (plcc) using computational fluid dynamic (cfd) software, fluent™ |
| publisher |
AENSI Publisher All rights reserved |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/34332 |
| _version_ |
1643797449036267520 |
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13.222552 |