Description: The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)

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Bibliographic Details
Main Authors:	Mazlan, Mohamed, A. Rahim, Iqbal, M. A., Mohd Mustafa Al Bakri, Abdullah, Wan Yusra Hannanah, Wan Abdul Razak, Mohd Sukhairi, Mat Rasat
Other Authors:	mazlan547@ppinang.uitm.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Computational Fluid Dynamic (CFD) Epoxy Moulding Compound (EMC) Package chip powers Plastic Leaded Chip Carrier (PLCC)
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34276
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