Optimization of fins used in electronic packaging
Link to publisher's homepage at http://www.emeraldinsight.com/
Saved in:
| Main Authors: | , , , , , , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
Emerald Group Publishing Limited
2014
|
| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/33924 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| id |
my.unimap-33924 |
|---|---|
| record_format |
dspace |
| spelling |
my.unimap-339242014-04-23T00:45:43Z Optimization of fins used in electronic packaging Ong, Kang Eu Lee, Kor Oon Seetharamu, Kankanhally N. Ishak, Abdul Azid, Dr. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Goh, Teck Joo leekoroon@yahoo.com knseetharamu@hotmail.com ishak@eng.usm.my gaquadir@unimap.edu.my Programming and algorithm theory Optimization techniques Electronics industry Heat transfer Link to publisher's homepage at http://www.emeraldinsight.com/ Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using the genetic algorithms (GAs). A range of fin shapes are investigated and the optimum solutions for various profile area are obtained. Findings - Provide information to thermal engineers to what extent any particular extended surface or fin arrangements could improve heat dissipation from a surface to the surrounding fluid. Smaller fin volume in fin design is preferable as the heat is dissipated more effectively. Research limitations/implications - Limited to cases where the correlations for heat transfer coefficients are valid. Practical implications - A very useful finding for practising thermal engineer especially in the area of electronic packaging as the parameters for the fin design can easily be found for any chosen profile area. Originality/value - A new method of using GA for optimization of fins is used here. The value of this paper lies in providing data for selecting suitable fins for thermal management in electronic systems. 2014-04-23T00:45:43Z 2014-04-23T00:45:43Z 2005 Article Microelectronics International, vol. 22(1), 2005, pages 10-15 1356-5362 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33924 http://www.emeraldinsight.com/journals.htm?articleid=1464715&show=abstract http://dx.doi.org/10.1108/13565360510575495 en Emerald Group Publishing Limited |
| institution |
Universiti Malaysia Perlis |
| building |
UniMAP Library |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Malaysia Perlis |
| content_source |
UniMAP Library Digital Repository |
| url_provider |
http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
Programming and algorithm theory Optimization techniques Electronics industry Heat transfer |
| spellingShingle |
Programming and algorithm theory Optimization techniques Electronics industry Heat transfer Ong, Kang Eu Lee, Kor Oon Seetharamu, Kankanhally N. Ishak, Abdul Azid, Dr. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Goh, Teck Joo Optimization of fins used in electronic packaging |
| description |
Link to publisher's homepage at http://www.emeraldinsight.com/ |
| author2 |
leekoroon@yahoo.com |
| author_facet |
leekoroon@yahoo.com Ong, Kang Eu Lee, Kor Oon Seetharamu, Kankanhally N. Ishak, Abdul Azid, Dr. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Goh, Teck Joo |
| format |
Article |
| author |
Ong, Kang Eu Lee, Kor Oon Seetharamu, Kankanhally N. Ishak, Abdul Azid, Dr. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Goh, Teck Joo |
| author_sort |
Ong, Kang Eu |
| title |
Optimization of fins used in electronic packaging |
| title_short |
Optimization of fins used in electronic packaging |
| title_full |
Optimization of fins used in electronic packaging |
| title_fullStr |
Optimization of fins used in electronic packaging |
| title_full_unstemmed |
Optimization of fins used in electronic packaging |
| title_sort |
optimization of fins used in electronic packaging |
| publisher |
Emerald Group Publishing Limited |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33924 |
| _version_ |
1643797348366680064 |
| score |
13.222552 |