Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP

• المؤلف الرئيسي: Tan Hui Khin
• مؤلفون آخرون: Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor)
• التنسيق: Learning Object
• اللغة: English
• منشور في: Universiti Malaysia Perlis 2008
• الموضوعات: Integrated circuit; Materials (Compound properties); Molding (Chemical technology); Molding; Molding > Technological innovations; Quad Flat Package
• الوصول للمادة أونلاين: http://dspace.unimap.edu.my/xmlui/handle/123456789/3373

In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding, molding, plating, singulation, trim and form. Molding (encapsulation process) is one of the key process which is done in order to p...