Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP

In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding, molding, plating, singulation, trim and form. Molding (encapsulation process) is one of the key process which is done in order to p...

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Main Author: Tan Hui Khin
Other Authors: Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor)
Format: Learning Object
Language:English
Published: Universiti Malaysia Perlis 2008
Subjects:
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/3373
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spelling my.unimap-33732009-02-20T09:13:33Z Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP Tan Hui Khin Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor) Integrated circuit Materials (Compound properties) Molding (Chemical technology) Molding Molding -- Technological innovations Quad Flat Package In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding, molding, plating, singulation, trim and form. Molding (encapsulation process) is one of the key process which is done in order to protect an electronic device from moisture, ion contamination, radiation, interference, and harsh environment. This means the package provides protection for the IC and defines the shape of the outer surface of the package. By applying pressure, the heated molten molding compound (EMC) is transferred from a plunger, through the runners, and into the mold cavities. There are many variables in terms of materials (EMC), equipments and tooling, and process parameters that should be controlled and improved in order to get a reliable and moldable product. In this research, the Side Gate Molding (SGM) technique was used for molding the 20mm x 20mm LQFP 144 Lead. This study is divided into two parts which are: (i). EMC Study; (ii). SGM Parameters Study. For the EMC study, the moldability of Green and Non-Green EMC are studied and compared to determined which type of EMC show a better moldability performance. From the result, it showed that both green and non-green EMC had an acceptable moldability performance. However, green EMC is more preferable in electronic packaging industry due to the safety consideration and better moldability in wire sweep issue. However, for SGM parameters study, a Design of Experiment (DOE) was conducted to generate the parameters range for better moldability which depends on which defects are more favorable to eliminate or reduce from a process parameters windowing. 2008-11-28T01:19:48Z 2008-11-28T01:19:48Z 2008-05 Learning Object http://hdl.handle.net/123456789/3373 en Universiti Malaysia Perlis School of Materials Engineering
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Integrated circuit
Materials (Compound properties)
Molding (Chemical technology)
Molding
Molding -- Technological innovations
Quad Flat Package
spellingShingle Integrated circuit
Materials (Compound properties)
Molding (Chemical technology)
Molding
Molding -- Technological innovations
Quad Flat Package
Tan Hui Khin
Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
description In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding, molding, plating, singulation, trim and form. Molding (encapsulation process) is one of the key process which is done in order to protect an electronic device from moisture, ion contamination, radiation, interference, and harsh environment. This means the package provides protection for the IC and defines the shape of the outer surface of the package. By applying pressure, the heated molten molding compound (EMC) is transferred from a plunger, through the runners, and into the mold cavities. There are many variables in terms of materials (EMC), equipments and tooling, and process parameters that should be controlled and improved in order to get a reliable and moldable product. In this research, the Side Gate Molding (SGM) technique was used for molding the 20mm x 20mm LQFP 144 Lead. This study is divided into two parts which are: (i). EMC Study; (ii). SGM Parameters Study. For the EMC study, the moldability of Green and Non-Green EMC are studied and compared to determined which type of EMC show a better moldability performance. From the result, it showed that both green and non-green EMC had an acceptable moldability performance. However, green EMC is more preferable in electronic packaging industry due to the safety consideration and better moldability in wire sweep issue. However, for SGM parameters study, a Design of Experiment (DOE) was conducted to generate the parameters range for better moldability which depends on which defects are more favorable to eliminate or reduce from a process parameters windowing.
author2 Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor)
author_facet Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor)
Tan Hui Khin
format Learning Object
author Tan Hui Khin
author_sort Tan Hui Khin
title Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
title_short Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
title_full Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
title_fullStr Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
title_full_unstemmed Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
title_sort developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for qfp
publisher Universiti Malaysia Perlis
publishDate 2008
url http://dspace.unimap.edu.my/xmlui/handle/123456789/3373
_version_ 1643787819575934976
score 13.211869