Experimental and numerical studies of finned L-shape heat pipe for notebook-PC cooling

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Main Authors: Mohamed H A, Elnaggar, Mohd. Zulkifly, Abdullah, Dr., Munusamy, Sri Raj Rajeswari
Other Authors: mohdhn@yahoo.com
Format: Article
Language:English
Published: Institute of Electrical and Electronics Engineers (IEEE) 2014
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Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32977
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spelling my.unimap-329772014-03-21T07:59:29Z Experimental and numerical studies of finned L-shape heat pipe for notebook-PC cooling Mohamed H A, Elnaggar Mohd. Zulkifly, Abdullah, Dr. Munusamy, Sri Raj Rajeswari mohdhn@yahoo.com mezul@eng.usm.my rajeswari@unimap.edu.my Coolant airflow rate Heat input L-shape heat pipe Liquid pressure drop Thermal resistance Wall temperature Link to publisher's homepage at http://ieeexplore.ieee.org/ This paper presents the experimental, numerical, and analytical investigations on the horizontal L-shape heat pipe for the notebook-CPU cooling. Simulations are carried out for both the 2-D and 3-D cases. In a 3-D model, the heat pipe as a whole is modeled based on the heat transfer by conduction. The heat pipe is assumed to be a conducting medium without taking into account the events occurring inside the heat pipe. A 2-D model based on the characterization of the working fluid inside the heat pipe is the other developed model. The 2-D finite element simulation is performed under natural and forced convection modes, by using ANSYS-FLOTRAN. Moreover, the design of experiment software is employed to optimize the coolant airflow rate and the heat input to get the best performance of heat pipe. The wall temperatures, velocity, and pressure distributions of the vapor and the liquid are analyzed. The heat inputs of the minimum thermal resistance in both natural and forced convection are found to be 20 and 35 W, respectively. The simulation and experimental wall temperatures are found to be a good match. Accordingly, the numerical solution is in agreement with the analytical solution in terms of vapor and liquid pressure drops 2014-03-21T07:59:29Z 2014-03-21T07:59:29Z 2013 Article IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 3(6), 2013, pages 978-988 2156-3950 http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6509409 http://dspace.unimap.edu.my:80/dspace/handle/123456789/32977 en Institute of Electrical and Electronics Engineers (IEEE)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Coolant airflow rate
Heat input
L-shape heat pipe
Liquid pressure drop
Thermal resistance
Wall temperature
spellingShingle Coolant airflow rate
Heat input
L-shape heat pipe
Liquid pressure drop
Thermal resistance
Wall temperature
Mohamed H A, Elnaggar
Mohd. Zulkifly, Abdullah, Dr.
Munusamy, Sri Raj Rajeswari
Experimental and numerical studies of finned L-shape heat pipe for notebook-PC cooling
description Link to publisher's homepage at http://ieeexplore.ieee.org/
author2 mohdhn@yahoo.com
author_facet mohdhn@yahoo.com
Mohamed H A, Elnaggar
Mohd. Zulkifly, Abdullah, Dr.
Munusamy, Sri Raj Rajeswari
format Article
author Mohamed H A, Elnaggar
Mohd. Zulkifly, Abdullah, Dr.
Munusamy, Sri Raj Rajeswari
author_sort Mohamed H A, Elnaggar
title Experimental and numerical studies of finned L-shape heat pipe for notebook-PC cooling
title_short Experimental and numerical studies of finned L-shape heat pipe for notebook-PC cooling
title_full Experimental and numerical studies of finned L-shape heat pipe for notebook-PC cooling
title_fullStr Experimental and numerical studies of finned L-shape heat pipe for notebook-PC cooling
title_full_unstemmed Experimental and numerical studies of finned L-shape heat pipe for notebook-PC cooling
title_sort experimental and numerical studies of finned l-shape heat pipe for notebook-pc cooling
publisher Institute of Electrical and Electronics Engineers (IEEE)
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/32977
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score 13.222552