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Micropump pattern replication using Printed Circuit Board (PCB) technology

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Main Authors: Pei, Song Chee, Rashidah @ Siti Saedah, Arsat, Dr., Uda, Hashim, Prof. Dr., Ruzairi, Abdul Rahim, Prof. Dr., Loew, Pei Ling, Dr.
Other Authors: pschee2@live.utm.my
Format: Article
Language:English
Published: Taylor and Francis Group, LLC. 2014
Subjects:
Diffuser
Electromganetic
Hot embossing
Microfluidic
Micromechanical
Micropump
PCB
Polymers
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32907
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spelling my.unimap-329072014-03-20T05:15:44Z Micropump pattern replication using Printed Circuit Board (PCB) technology Pei, Song Chee Rashidah @ Siti Saedah, Arsat, Dr. Uda, Hashim, Prof. Dr. Ruzairi, Abdul Rahim, Prof. Dr. Loew, Pei Ling, Dr. pschee2@live.utm.my rashidah@fke.utm.my uda@unimap.edu.my ruzairi@fke.utm.my leowpl@fke.utm.my Diffuser Electromganetic Hot embossing Microfluidic Micromechanical Micropump PCB Polymers Link to publisher's homepage at www.taylorandfrancisgroup.com/ This article shows a low-cost rapid hot embossing poly (methylmeth acrylate) (PMMA)-based micropump replication with printed circuit board (PCB) mold. PCB material offers advantages of low cost, rigid, and rapid thermal response characteristic. Unlike conventional hot embossing setup, the presented process involved the usage of simple machinery tools: laboratory oven (heat transfer), G-clamp (force deliver), and two aluminium plates (isothermal heat plates). Diffuser and pump chamber were successfully imprinted with the depth of 450 m and verified pump performance with other reported literatures. To avoid complex bonding process between actuator and membrane, electromagnetic pinch actuation is introduced. The micropump poses flow rate characteristic of 6.66 ml/min and a back pressure of 1.6 kPa under optimum pinch frequency. 2014-03-20T05:15:43Z 2014-03-20T05:15:43Z 2013-06-01 Article Materials and Manufacturing Processes, vol. 28(6), 2013, pages 702-706 1042-6914 http://www.tandfonline.com/doi/abs/10.1080/10426914.2012.736664#.Uyp47qiSyyo http://dspace.unimap.edu.my:80/dspace/handle/123456789/32907 en Taylor and Francis Group, LLC.
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Diffuser
Electromganetic
Hot embossing
Microfluidic
Micromechanical
Micropump
PCB
Polymers
spellingShingle Diffuser
Electromganetic
Hot embossing
Microfluidic
Micromechanical
Micropump
PCB
Polymers
Pei, Song Chee
Rashidah @ Siti Saedah, Arsat, Dr.
Uda, Hashim, Prof. Dr.
Ruzairi, Abdul Rahim, Prof. Dr.
Loew, Pei Ling, Dr.
Micropump pattern replication using Printed Circuit Board (PCB) technology
description Link to publisher's homepage at www.taylorandfrancisgroup.com/
author2 pschee2@live.utm.my
author_facet pschee2@live.utm.my
Pei, Song Chee
Rashidah @ Siti Saedah, Arsat, Dr.
Uda, Hashim, Prof. Dr.
Ruzairi, Abdul Rahim, Prof. Dr.
Loew, Pei Ling, Dr.
format Article
author Pei, Song Chee
Rashidah @ Siti Saedah, Arsat, Dr.
Uda, Hashim, Prof. Dr.
Ruzairi, Abdul Rahim, Prof. Dr.
Loew, Pei Ling, Dr.
author_sort Pei, Song Chee
title Micropump pattern replication using Printed Circuit Board (PCB) technology
title_short Micropump pattern replication using Printed Circuit Board (PCB) technology
title_full Micropump pattern replication using Printed Circuit Board (PCB) technology
title_fullStr Micropump pattern replication using Printed Circuit Board (PCB) technology
title_full_unstemmed Micropump pattern replication using Printed Circuit Board (PCB) technology
title_sort micropump pattern replication using printed circuit board (pcb) technology
publisher Taylor and Francis Group, LLC.
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/32907
_version_ 1643797027207774208
score 13.214268

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