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Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder

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Main Authors: Flora Somidin, Mohd Arif Anuar, Mohd Salleh, Khairel Rafezi, Ahmad, Dr.
Other Authors: florasom@gmail.com
Format: Article
Language:English
Published: Scientific.Net 2014
Subjects:
Composite solder
Intermetallic compound
Powder metallurgy
Recycle-aluminum
Sn-0.7Cu
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32463
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spelling my.unimap-324632022-12-16T01:18:30Z Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder Flora Somidin Mohd Arif Anuar, Mohd Salleh Khairel Rafezi, Ahmad, Dr. florasom@gmail.com arifanuar@unimap.edu.my rafezi@unimap.edu.my Composite solder Intermetallic compound Powder metallurgy Recycle-aluminum Sn-0.7Cu Link to publisher's homepage at http://www.scientific.net/ Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper focuses on the intermetallic compound (IMC) formation study between the fabricated solder composite on Cu-substrate. Throughout this study, four different composition of Sn-0.7Cu/re-Al (0.0, 3.0, 3.5, 4.0 wt.%) were studied. X-ray diffraction (XRD) was used to analyze the IMCs phase formation between the interfaces. New IMC phase of Cu9Al4 was detected beside Cu6Sn5 and Cu3Sn in the composite solder samples. However, Sn-0.7Cu/3.0re-Al showed least formation of brittle IMCs compared to the monolithic solder. 2014-03-09T09:53:26Z 2014-03-09T09:53:26Z 2012-12 Article Advanced Materials Research, vol.620, 2012, pages 105-111 1662-8985 http://dspace.unimap.edu.my:80/dspace/handle/123456789/32463 http://www.scientific.net/AMR.620.105 en Scientific.Net
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Composite solder
Intermetallic compound
Powder metallurgy
Recycle-aluminum
Sn-0.7Cu
spellingShingle Composite solder
Intermetallic compound
Powder metallurgy
Recycle-aluminum
Sn-0.7Cu
Flora Somidin
Mohd Arif Anuar, Mohd Salleh
Khairel Rafezi, Ahmad, Dr.
Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
description Link to publisher's homepage at http://www.scientific.net/
author2 florasom@gmail.com
author_facet florasom@gmail.com
Flora Somidin
Mohd Arif Anuar, Mohd Salleh
Khairel Rafezi, Ahmad, Dr.
format Article
author Flora Somidin
Mohd Arif Anuar, Mohd Salleh
Khairel Rafezi, Ahmad, Dr.
author_sort Flora Somidin
title Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
title_short Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
title_full Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
title_fullStr Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
title_full_unstemmed Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
title_sort intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
publisher Scientific.Net
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/32463
_version_ 1753972972751683584
score 13.214268

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