Novel in-house fabrication of nano lab-on-chip devices

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Main Authors: Tijjani Adam, Shuwa, Uda, Hashim, Prof. Dr., Dhahi, Th Sabar, Leow, Pei Ling, Chee, Pei Song
Other Authors: tijjaniadam@yahoo.com.my
Format: Article
Language:English
Published: Bentham Science Publishers 2014
Subjects:
Hpm
Rie
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32433
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spelling my.unimap-324332014-03-09T03:54:39Z Novel in-house fabrication of nano lab-on-chip devices Tijjani Adam, Shuwa Uda, Hashim, Prof. Dr. Dhahi, Th Sabar Leow, Pei Ling Chee, Pei Song tijjaniadam@yahoo.com.my uda@unimap.edu.my leowpl@fke.utm.my pschee2@live.utm.my Asem Buffered thermal re-etch Characterization Fabrication Hpm Lab on chip Rie Link to publisher's homepage at http://www.benthamscience.com/ 20nm SiNWs transducers have been fabricated by means of simple in-house fabrication method. A low cost, simple top-down approach has been successfully used for the fabrication of very sensitive SiNWs. The fabrication was done without using costly deep reactive ion etching (DRIE) or reactive ion etching (RIE). The process started by patterning wire marked through photoresist and the marked resist was deepened into buffered oxide etch (BOE) for 30mins to etch away the oxide present on the polysilicon surface leaving the photoresist masked portion un etched. Wires of <3um were obtained with 6 buffered thermal re-etch processes The wire pattern was trimmed to 20nm using dry etching with constant 5% reduction at 1100°C for 40/5 minutes for Oxidation/BOE respectively. Electrical characterization conducted has shown an increase in sensitivity with the reduction in size while resistance increases at constants 70V supply, the characterized device was surface modified and tested on real sample. The device shows a very good response to the concentration of molecular species in the sample and surface morphology of the device was verified using high powered microscope (HPM) and scanning electron microscope (SEM) for the size reduction. Moreover, the technique can be easily employed for different semiconductor materials without any additional complexity. Hence, a novel and simple approach for fabricating SiNWs as sensors in nanosized with high uniformity is demonstrated. 2014-03-09T03:54:39Z 2014-03-09T03:54:39Z 2013 Article Current Nanoscience, vol. 9(4), 2013, pages 543-551 1573-4137 http://www.eurekaselect.com/113135/article http://dspace.unimap.edu.my:80/dspace/handle/123456789/32433 en Bentham Science Publishers
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Asem
Buffered thermal re-etch
Characterization
Fabrication
Hpm
Lab on chip
Rie
spellingShingle Asem
Buffered thermal re-etch
Characterization
Fabrication
Hpm
Lab on chip
Rie
Tijjani Adam, Shuwa
Uda, Hashim, Prof. Dr.
Dhahi, Th Sabar
Leow, Pei Ling
Chee, Pei Song
Novel in-house fabrication of nano lab-on-chip devices
description Link to publisher's homepage at http://www.benthamscience.com/
author2 tijjaniadam@yahoo.com.my
author_facet tijjaniadam@yahoo.com.my
Tijjani Adam, Shuwa
Uda, Hashim, Prof. Dr.
Dhahi, Th Sabar
Leow, Pei Ling
Chee, Pei Song
format Article
author Tijjani Adam, Shuwa
Uda, Hashim, Prof. Dr.
Dhahi, Th Sabar
Leow, Pei Ling
Chee, Pei Song
author_sort Tijjani Adam, Shuwa
title Novel in-house fabrication of nano lab-on-chip devices
title_short Novel in-house fabrication of nano lab-on-chip devices
title_full Novel in-house fabrication of nano lab-on-chip devices
title_fullStr Novel in-house fabrication of nano lab-on-chip devices
title_full_unstemmed Novel in-house fabrication of nano lab-on-chip devices
title_sort novel in-house fabrication of nano lab-on-chip devices
publisher Bentham Science Publishers
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/32433
_version_ 1643796901037867008
score 13.214268