Research advances of composite solder material fabricated via powder metallurgy route
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2014
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my.unimap-320222014-02-19T07:15:02Z Research advances of composite solder material fabricated via powder metallurgy route Mohd Arif Anuar, Mohd Salleh Muhammad Hafiz, Hazizi Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Ramani, Mayapan Zainal Ariffin, Ahmad arifanuar@unimap.edu.my hafizhazizi@unimap.edu.my Composite Lead-Free solder Powder metallurgy Composite solder Link to publisher's homepage at http://www.scientific.net/ Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder materials developed by composite approach showed improvement in their properties and importantly it improved their service performance when compared with solder materials developed by other methods. This paper reviews the solder properties of various types of composite lead-free solder that were fabricated via powder metallurgy route. The fabrication processes of the composite solder material by using powder metallurgy route which involved mixing the powder homogeneously, compaction of the mixed powder and sintering the green body were discussed in detail. The types of reinforcements used in order to enhance its properties and the roles of the reinforcement used were also discussed in detail. Properties of a desirable composite solder and the effects of the reinforcement addition to the composite solder microstructure, changes in its wettability and improvement of its mechanical properties were later discussed in this paper. In conclusion, by reviewing various research advances in composite solder material, a solder material with high solder joint reliability at elevated temperature have yet to be found. Thus, a novel composite solder material with higher solder joint reliability at room and elevated temperature was proposed. 2014-02-19T07:15:02Z 2014-02-19T07:15:02Z 2012-12 Article Mohd Arif Anuar Mohd Salleh et al., Advanced Materials Research, vol.626, 2012, pages 791-796 1662-8985 http://dspace.unimap.edu.my:80/dspace/handle/123456789/32022 http://www.scientific.net/AMR.626.791 en Scientific.Net/Trans Tech Publications |
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English |
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Composite Lead-Free solder Powder metallurgy Composite solder |
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Composite Lead-Free solder Powder metallurgy Composite solder Mohd Arif Anuar, Mohd Salleh Muhammad Hafiz, Hazizi Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Ramani, Mayapan Zainal Ariffin, Ahmad Research advances of composite solder material fabricated via powder metallurgy route |
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Link to publisher's homepage at http://www.scientific.net/ |
| author2 |
arifanuar@unimap.edu.my |
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arifanuar@unimap.edu.my Mohd Arif Anuar, Mohd Salleh Muhammad Hafiz, Hazizi Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Ramani, Mayapan Zainal Ariffin, Ahmad |
| format |
Article |
| author |
Mohd Arif Anuar, Mohd Salleh Muhammad Hafiz, Hazizi Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Ramani, Mayapan Zainal Ariffin, Ahmad |
| author_sort |
Mohd Arif Anuar, Mohd Salleh |
| title |
Research advances of composite solder material fabricated via powder metallurgy route |
| title_short |
Research advances of composite solder material fabricated via powder metallurgy route |
| title_full |
Research advances of composite solder material fabricated via powder metallurgy route |
| title_fullStr |
Research advances of composite solder material fabricated via powder metallurgy route |
| title_full_unstemmed |
Research advances of composite solder material fabricated via powder metallurgy route |
| title_sort |
research advances of composite solder material fabricated via powder metallurgy route |
| publisher |
Scientific.Net/Trans Tech Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/32022 |
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1643796741661655040 |
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13.214268 |