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The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition

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Main Authors: Mohd Khairuddin, Md Arshad, Ibrahim, Ahmad, Azman, Jalar, Ghazali, Omar
Format: Article
Language:English
Published: Elsevier Science 2008
Subjects:
Electroless nickel immersion gold (ENIG)
Under bump metallurgy (UBM)
Surface roughness
Zincation
Mechanical engineering
Surface morphology
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/3018
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spelling my.unimap-30182013-10-17T11:59:29Z The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition Mohd Khairuddin, Md Arshad Ibrahim, Ahmad Azman, Jalar Ghazali, Omar Electroless nickel immersion gold (ENIG) Under bump metallurgy (UBM) Surface roughness Zincation Mechanical engineering Surface morphology Link to publisher's homepage at www.elsevier.com/locate/microrel This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump metallurgy (UBM) deposition. The Atomic Force Microscopy (AFM) and Scanning Electron Microscopy (SEM) techniques were used to obtain the surface roughness and morphology of each deposition process. The elemental analysis using Energy Disperse X-Ray (EDX) and precision micro-cross-section using Focus Ion Beam (FIB) was also used in this study. The first zincation process has high surface roughness but preserved surface morphology of initial thin-film surface. The second zincation provides the improved surface roughness due to the replacement aluminum layer with ion zinc in the solution. Smooth surfaces leads to better shear strength. However, second zincation will affect the Al thickness, hence excessive attacks on Al layer may cause reliability problem. 2008-11-06T05:05:12Z 2008-11-06T05:05:12Z 2006 Article Microelectronics Reliability, vol.46, 2006, pages 367-379. 10.1016/j.microrel.2005.01.018 http://hdl.handle.net/123456789/3018 http://www.elsevier.com/locate/microrel en 10.1016/j.microrel.2005.01.018 Elsevier Science
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Electroless nickel immersion gold (ENIG)
Under bump metallurgy (UBM)
Surface roughness
Zincation
Mechanical engineering
Surface morphology
spellingShingle Electroless nickel immersion gold (ENIG)
Under bump metallurgy (UBM)
Surface roughness
Zincation
Mechanical engineering
Surface morphology
Mohd Khairuddin, Md Arshad
Ibrahim, Ahmad
Azman, Jalar
Ghazali, Omar
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
description Link to publisher's homepage at www.elsevier.com/locate/microrel
format Article
author Mohd Khairuddin, Md Arshad
Ibrahim, Ahmad
Azman, Jalar
Ghazali, Omar
author_facet Mohd Khairuddin, Md Arshad
Ibrahim, Ahmad
Azman, Jalar
Ghazali, Omar
author_sort Mohd Khairuddin, Md Arshad
title The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
title_short The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
title_full The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
title_fullStr The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
title_full_unstemmed The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
title_sort surface characteristics of under bump metallurgy (ubm) in electroless nickel immersion gold (enig) deposition
publisher Elsevier Science
publishDate 2008
url http://dspace.unimap.edu.my/xmlui/handle/123456789/3018
_version_ 1643787622587301888
score 13.214268

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