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Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application

The team has won gold medal and Korea University Invention Association (KUIA) Special Award at Macau International Innovation & Invention Expo 2012, 29th June - 1st July 2012 was held at Macau Fisherman Wharf Exhibition Centre Macau, China.

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Bibliographic Details
Main Authors: Aida Fakhrul, Lamakasauk, Nurul Shakina, Surani, Mohd Arif Anuar, Mohd Salleh, Nik Noriman, Zulkepli, Dr., Mohd Mustafa Al-Bakri, Abdullah, Rosniza, Hamzah, Mohamad, Abu Bakar
Other Authors: arifanuar@unimap.edu.my
Format: Other
Language:English
Published: Macao Innovation & Invention Association 2013
Subjects:
Underfill material
Epoxy polymer
Epoxidized natural rubber
Polymer hybrid
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/27113
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spelling my.unimap-271132013-07-25T06:12:38Z Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application Aida Fakhrul, Lamakasauk Nurul Shakina, Surani Mohd Arif Anuar, Mohd Salleh Nik Noriman, Zulkepli, Dr. Mohd Mustafa Al-Bakri, Abdullah Rosniza, Hamzah Mohamad, Abu Bakar arifanuar@unimap.edu.my Underfill material Epoxy polymer Epoxidized natural rubber Polymer hybrid The team has won gold medal and Korea University Invention Association (KUIA) Special Award at Macau International Innovation & Invention Expo 2012, 29th June - 1st July 2012 was held at Macau Fisherman Wharf Exhibition Centre Macau, China. Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system. 2013-07-25T05:32:05Z 2013-07-25T05:32:05Z 2012-06-29 Other http://hdl.handle.net/123456789/27113 en Macau International Innovation & Invention Expo (IIEX) 2012 Macao Innovation & Invention Association
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Underfill material
Epoxy polymer
Epoxidized natural rubber
Polymer hybrid
spellingShingle Underfill material
Epoxy polymer
Epoxidized natural rubber
Polymer hybrid
Aida Fakhrul, Lamakasauk
Nurul Shakina, Surani
Mohd Arif Anuar, Mohd Salleh
Nik Noriman, Zulkepli, Dr.
Mohd Mustafa Al-Bakri, Abdullah
Rosniza, Hamzah
Mohamad, Abu Bakar
Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
description The team has won gold medal and Korea University Invention Association (KUIA) Special Award at Macau International Innovation & Invention Expo 2012, 29th June - 1st July 2012 was held at Macau Fisherman Wharf Exhibition Centre Macau, China.
author2 arifanuar@unimap.edu.my
author_facet arifanuar@unimap.edu.my
Aida Fakhrul, Lamakasauk
Nurul Shakina, Surani
Mohd Arif Anuar, Mohd Salleh
Nik Noriman, Zulkepli, Dr.
Mohd Mustafa Al-Bakri, Abdullah
Rosniza, Hamzah
Mohamad, Abu Bakar
format Other
author Aida Fakhrul, Lamakasauk
Nurul Shakina, Surani
Mohd Arif Anuar, Mohd Salleh
Nik Noriman, Zulkepli, Dr.
Mohd Mustafa Al-Bakri, Abdullah
Rosniza, Hamzah
Mohamad, Abu Bakar
author_sort Aida Fakhrul, Lamakasauk
title Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
title_short Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
title_full Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
title_fullStr Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
title_full_unstemmed Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
title_sort green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
publisher Macao Innovation & Invention Association
publishDate 2013
url http://dspace.unimap.edu.my/xmlui/handle/123456789/27113
_version_ 1643795161946259456
score 13.222552

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