Technical barriers and development of Cu wirebonding in nanoelectronics device packaging

• Main Authors: C., L. Gan, E., K. Ng, B., L. Chan, Uda, Hashim, Prof. Dr., F., C. Classe
• 其他作者: clgan [e-mail]
• 格式: Article
• 语言: English
• 出版: Hindawi Publishing Corporation 2013
• 主题: Nanoelectronics; Wirebonding; Cu wire
• 在线阅读: http://dspace.unimap.edu.my/xmlui/handle/123456789/26072

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