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Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application

This team has won gold medal at National Research and Innovation Competition (NRIC) 2012, 17th - 19th July 2012 was held at Dewan Utama Pelajar, located at USM Main Campus, Penang, Malaysia.

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Bibliographic Details
Main Authors: Aida Fakhrul, Lamakasauk, Nurul Shakina, Surani, Mohd Arif Anuar, Mohd Salleh, Nik Noriman, Zulkepli, Dr., Mohd Mustafa Al-Bakri, Abdullah, Rosniza, Hamzah, Mohamad, Abu Bakar
Other Authors: arifanuar@unimap.edu.my
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Published: Universiti Sains Malaysia 2013
Subjects:
Underfill material
Polymer hybrid
Epoxy polymer
Underfill material in electronic packaging
UniMAP > Research and development
UniMAP > Competition
National Research and Innovation Competition 2012
NRIC 2012
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/25704
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spelling my.unimap-257042013-06-11T09:17:05Z Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application Aida Fakhrul, Lamakasauk Nurul Shakina, Surani Mohd Arif Anuar, Mohd Salleh Nik Noriman, Zulkepli, Dr. Mohd Mustafa Al-Bakri, Abdullah Rosniza, Hamzah Mohamad, Abu Bakar arifanuar@unimap.edu.my Underfill material Polymer hybrid Epoxy polymer Underfill material in electronic packaging UniMAP -- Research and development UniMAP -- Competition National Research and Innovation Competition 2012 NRIC 2012 This team has won gold medal at National Research and Innovation Competition (NRIC) 2012, 17th - 19th July 2012 was held at Dewan Utama Pelajar, located at USM Main Campus, Penang, Malaysia. Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system. 2013-06-11T09:17:04Z 2013-06-11T09:17:04Z 2012-07-17 http://hdl.handle.net/123456789/25704 National Research and Innovation Competition (NRIC) 2012 Universiti Sains Malaysia
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
topic Underfill material
Polymer hybrid
Epoxy polymer
Underfill material in electronic packaging
UniMAP -- Research and development
UniMAP -- Competition
National Research and Innovation Competition 2012
NRIC 2012
spellingShingle Underfill material
Polymer hybrid
Epoxy polymer
Underfill material in electronic packaging
UniMAP -- Research and development
UniMAP -- Competition
National Research and Innovation Competition 2012
NRIC 2012
Aida Fakhrul, Lamakasauk
Nurul Shakina, Surani
Mohd Arif Anuar, Mohd Salleh
Nik Noriman, Zulkepli, Dr.
Mohd Mustafa Al-Bakri, Abdullah
Rosniza, Hamzah
Mohamad, Abu Bakar
Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
description This team has won gold medal at National Research and Innovation Competition (NRIC) 2012, 17th - 19th July 2012 was held at Dewan Utama Pelajar, located at USM Main Campus, Penang, Malaysia.
author2 arifanuar@unimap.edu.my
author_facet arifanuar@unimap.edu.my
Aida Fakhrul, Lamakasauk
Nurul Shakina, Surani
Mohd Arif Anuar, Mohd Salleh
Nik Noriman, Zulkepli, Dr.
Mohd Mustafa Al-Bakri, Abdullah
Rosniza, Hamzah
Mohamad, Abu Bakar
format
author Aida Fakhrul, Lamakasauk
Nurul Shakina, Surani
Mohd Arif Anuar, Mohd Salleh
Nik Noriman, Zulkepli, Dr.
Mohd Mustafa Al-Bakri, Abdullah
Rosniza, Hamzah
Mohamad, Abu Bakar
author_sort Aida Fakhrul, Lamakasauk
title Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
title_short Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
title_full Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
title_fullStr Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
title_full_unstemmed Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
title_sort green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
publisher Universiti Sains Malaysia
publishDate 2013
url http://dspace.unimap.edu.my/xmlui/handle/123456789/25704
_version_ 1643794764122816512
score 13.214268

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