APA引文

Iziana, Y., & izianayahya@gmail.com. (2013). Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method. Scientific.Net.

Chicago Style Citation

Iziana, Yahya, and izianayahya@gmail.com. Characterization of Sn-3.5Ag-1.0Cu Lead-free Solder Prepared Via Powder Metallurgy Method. Scientific.Net, 2013.

MLA引文

Iziana, Yahya, and izianayahya@gmail.com. Characterization of Sn-3.5Ag-1.0Cu Lead-free Solder Prepared Via Powder Metallurgy Method. Scientific.Net, 2013.

警告：这些引文格式不一定是100％准确.