Iziana, Y., & izianayahya@gmail.com. (2013). Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method. Scientific.Net.
シカゴスタイル引用形Iziana, Yahya, and izianayahya@gmail.com. Characterization of Sn-3.5Ag-1.0Cu Lead-free Solder Prepared Via Powder Metallurgy Method. Scientific.Net, 2013.
MLA引用形式Iziana, Yahya, and izianayahya@gmail.com. Characterization of Sn-3.5Ag-1.0Cu Lead-free Solder Prepared Via Powder Metallurgy Method. Scientific.Net, 2013.
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