Modular architecture of a non-contact pinch actuation micropump

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Main Authors: Chee, Pei Song, Rashidah, Arsat. Dr., Tijjani Adam, Shuwa, Uda, Hashim, Prof. Dr., Ruzairi, Abdul Rahim, Prof. Dr., Leow, Pei Ling
Other Authors: pschee2@live.utm.my
Format: Article
Language:English
Published: MDPI, Basel, Switzerland. 2013
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Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/24195
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spelling my.unimap-241952014-04-08T09:01:59Z Modular architecture of a non-contact pinch actuation micropump Chee, Pei Song Rashidah, Arsat. Dr. Tijjani Adam, Shuwa Uda, Hashim, Prof. Dr. Ruzairi, Abdul Rahim, Prof. Dr. Leow, Pei Ling pschee2@live.utm.my rashidah@fke.utm.my tijjaniadam@yahoo.com uda@unimap.edu.my ruzairi@fke.utm.my leowpl@fke.utm.my Diffuser Electromagnetic micropump Hot embossing Lab on chip Link to publisher's homepage http://www.mdpi.com/ This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0-5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0-80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz. 2013-04-01T03:15:09Z 2013-04-01T03:15:09Z 2012-09 Article Sensors (Switzerland), vol. 12 (9), 2012, pages 12572-12587 1424-8220 http://www.mdpi.com/1424-8220/12/9/12572 http://hdl.handle.net/123456789/24195 en MDPI, Basel, Switzerland.
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Diffuser
Electromagnetic micropump
Hot embossing
Lab on chip
spellingShingle Diffuser
Electromagnetic micropump
Hot embossing
Lab on chip
Chee, Pei Song
Rashidah, Arsat. Dr.
Tijjani Adam, Shuwa
Uda, Hashim, Prof. Dr.
Ruzairi, Abdul Rahim, Prof. Dr.
Leow, Pei Ling
Modular architecture of a non-contact pinch actuation micropump
description Link to publisher's homepage http://www.mdpi.com/
author2 pschee2@live.utm.my
author_facet pschee2@live.utm.my
Chee, Pei Song
Rashidah, Arsat. Dr.
Tijjani Adam, Shuwa
Uda, Hashim, Prof. Dr.
Ruzairi, Abdul Rahim, Prof. Dr.
Leow, Pei Ling
format Article
author Chee, Pei Song
Rashidah, Arsat. Dr.
Tijjani Adam, Shuwa
Uda, Hashim, Prof. Dr.
Ruzairi, Abdul Rahim, Prof. Dr.
Leow, Pei Ling
author_sort Chee, Pei Song
title Modular architecture of a non-contact pinch actuation micropump
title_short Modular architecture of a non-contact pinch actuation micropump
title_full Modular architecture of a non-contact pinch actuation micropump
title_fullStr Modular architecture of a non-contact pinch actuation micropump
title_full_unstemmed Modular architecture of a non-contact pinch actuation micropump
title_sort modular architecture of a non-contact pinch actuation micropump
publisher MDPI, Basel, Switzerland.
publishDate 2013
url http://dspace.unimap.edu.my/xmlui/handle/123456789/24195
_version_ 1643794265816432640
score 13.22586