Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
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2013
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my.unimap-236482020-09-11T02:25:53Z Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder Mohd Arif Anuar, Mohd Salleh Mohd Mustafa Al-Bakri, Abdullah Muhammad Hafiz, Zan Hazizi Flora, Somidin Noor Farhani, Mohd Alui Zainal Arifin, Ahmad, Prof. arifanuar@unimap.edu.my mustafa_albakri@unimap.edu.my hafizhazizi@unimap.edu.my zainal@eng.usm.my Composite Lead-free solder Powder metallurgy Silicon nitride Link to publisher's homepage at http://www.elsevier.com The use of reinforcing high performance ceramic particulates in monolithic lead-free solder is one way to improve the service temperature and mechanical behavior of a solder joint. In this study, various compositions of Sn-0.7Cu/Si 3N 4 lead-free composite solder were fabricated via the application of powder metallurgy (PM) techniques. The influences of the Si 3N 4 particulates in the monolithic matrix solder on the melting point temperature (T m), microhardness value, lap-shear strength, and surface fracture mechanisms were investigated based on the weight percentage addition used (0.5wt%, 1.0wt%, and 1.5wt%). Minimal alteration of the melting point temperature of the composite solder sample was obtained. Improvements in the microhardness value and lap-shear strength were found for higher reinforcements of Si 3N 4 particulates, which revealed the formation of a more ductile fracture mode in the composite solder samples. The increasing addition of Si 3N 4 allowed the formation of homogeneous and finer dimples. Overall, the addition of Si 3N 4 particulates to the Sn-0.7Cu lead-free solder should be higher than 1.0wt%, as these compositions showed superior mechanical properties. 2013-02-18T03:50:21Z 2013-02-18T03:50:21Z 2012-10 Article Materials Science and Engineering A, vol. 556, 2012, pages 633-637 0921-5093 http://www.sciencedirect.com/science/article/pii/S0921509312010015 http://dspace.unimap.edu.my/123456789/23648 en Elsevier B.V. |
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English |
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Composite Lead-free solder Powder metallurgy Silicon nitride |
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Composite Lead-free solder Powder metallurgy Silicon nitride Mohd Arif Anuar, Mohd Salleh Mohd Mustafa Al-Bakri, Abdullah Muhammad Hafiz, Zan Hazizi Flora, Somidin Noor Farhani, Mohd Alui Zainal Arifin, Ahmad, Prof. Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder |
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Link to publisher's homepage at http://www.elsevier.com |
| author2 |
arifanuar@unimap.edu.my |
| author_facet |
arifanuar@unimap.edu.my Mohd Arif Anuar, Mohd Salleh Mohd Mustafa Al-Bakri, Abdullah Muhammad Hafiz, Zan Hazizi Flora, Somidin Noor Farhani, Mohd Alui Zainal Arifin, Ahmad, Prof. |
| format |
Article |
| author |
Mohd Arif Anuar, Mohd Salleh Mohd Mustafa Al-Bakri, Abdullah Muhammad Hafiz, Zan Hazizi Flora, Somidin Noor Farhani, Mohd Alui Zainal Arifin, Ahmad, Prof. |
| author_sort |
Mohd Arif Anuar, Mohd Salleh |
| title |
Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder |
| title_short |
Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder |
| title_full |
Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder |
| title_fullStr |
Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder |
| title_full_unstemmed |
Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder |
| title_sort |
mechanical properties of sn-0.7cu/si 3n 4 lead-free composite solder |
| publisher |
Elsevier B.V. |
| publishDate |
2013 |
| url |
http://dspace.unimap.edu.my/123456789/23648 |
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1678593996435226624 |
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13.214268 |